Dell 1135N Service Manual - Page 165

PBA SUB-FEED=>Sub Printed circuit Board

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Re ere ce I or tio ACRONYM SPRING CS RE SPRING CS FR PMO-BUSHING FINGER, F ICT-SHAFT-EXIT LOWER ID SPRING-EXIT ROLL FD PMO-BUSHING_P/U,MP PMO-GEAR P/U MPF PBA SUB-MP SEN 80 2 IPR-GROUND PLATE A(OPC) CBF HARNESS-OPC GND IPR-GROUND PLATE SCF PBA SUB-FEED+P.EMP SEN. MOTOR STEP-MCK2(MAIN) GEAR-RDCN FEED INNER CBF-HARNESS-MAIN-THV WIRE CBF-HARNESS-MAIN-MHV WIRE CS=Compress EXPLANATION CS=Compress F=Front ID=Idler FD=Face Down P/U=Pickup P/U=Pickup PBA SUB-MP-SEN =>Sub Printed circuit Board Assembly for the MP-SEN (= Multi-Purpose (Bypass) 2 2 OPC=Organic Photo-Conductive OPC GNG=Organic Photo-Conductive-Ground SCF=Second Cassette Feeder (Tray2) PBA SUB-FEED=>Sub Printed circuit Board EMP SEN=Empty Sensor RDCN=Reduction THV =Transfer High Voltage MHV= High Voltage (Charge Voltage) 66 Service Manual

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Re ere
ce I
or
tio
66
Service Manual
SPRING CS RE
CS=Compress
SPRING CS FR
CS=Compress
PMO-BUSHING FINGER, F
F=Front
ICT-SHAFT-EXIT LOWER ID
ID=Idler
SPRING-EXIT ROLL FD
FD=Face Down
PMO-BUSHING_P/U,MP
P/U=Pickup
PMO-GEAR P/U MPF
P/U=Pickup
PBA SUB-MP SEN
PBA SUB-MP-SEN =>Sub Printed circuit Board
Assembly for the MP-SEN (= Multi-Purpose (Bypass)
80
2
2
2
IPR-GROUND PLATE A(OPC)
OPC=Organic Photo-Conductive
CBF HARNESS-OPC GND
OPC GNG=Organic Photo-Conductive-Ground
IPR-GROUND PLATE SCF
SCF=Second Cassette Feeder (Tray2)
PBA SUB-FEED+P.EMP SEN.
PBA SUB-FEED=>Sub Printed circuit Board
EMP SEN=Empty Sensor
MOTOR STEP-MCK2(MAIN)
GEAR-RDCN FEED INNER
RDCN=Reduction
CBF-HARNESS-MAIN-THV WIRE
THV =Transfer High Voltage
CBF-HARNESS-MAIN-MHV WIRE
MHV= High Voltage (Charge Voltage)
ACRONYM
EXPLANATION