Gateway EC14 Service Guide - Page 26

North Bridge Specifications, System Memory, Video Specifications, Specification - memory specifications

Page 26 highlights

Throttling 50%: On= 90°C; OFF=80°C OS shut down at 95°C; H/W shut down at 85°C North Bridge Specifications Item Specification Chipset Intel Crestline GS45 SFF Package FCBGA 1363 balls Features • Processor hosts bus supports 667/800/1066MHz FSB support. • Supports Dual Channel DDR2 SDRAM at 667/800MHz • Integrated SDRAM controller up to 8GB (2 SODIMM support) • DMI x2 and DMI x4 for connection between GMCH and ICH9M South Bridge Specifications Item Chipset Package Features Specification ICH9M SFF BGA 676 balls • Upstream accelerated Hub architecture interface for access to GMCH. • PCI Express Base Specification, Revivsion 1.1 support. • PCI 2.3 interface. (4 PCI Request/Grant pairs). • ACPI Power Management Logi Support. • Enhanced DMA controller, interupt controller, timers functions. • Integrated Serial ATA host controllers with independent DMA operation on six ports and AHCI support. • USB 1.1 and USB 2.0 Host controllers. • Supports Intel High Definition Audio (Intel HD Audio) Interface. • Supports Intel® Matrix Storage Technology. • Supports Intel® Active Mangement Technology. • Low Pin Count (LPC) interface. • 6 PCle ports. System Memory Item Memory size DIMM socket number Supports memory size per socket Supports maximum memory size Supports DIMM type Supports DIMM Speed Specification 0MB (No on-board Memory) 2 sockets 2GB 4GB for 64bit OS (with two 2GB SO-DIMM) DDR2 Synchronous DRAM 800/667 MHz Video Specifications Item Chipset Package Specification Intel® GS45 Express Chipset • 1329-ball FCBGA • Size: 34mm x 34mm • Ball pitch: 0.7mm 16 Chapter 1

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16
Chapter 1
Throttling 50%: On= 90°C; OFF=80°C
OS shut down at 95°C; H/W shut down at 85°C
North Bridge Specifications
South Bridge Specifications
System Memory
Video Specifications
Item
Specification
Chipset
Intel Crestline GS45 SFF
Package
FCBGA 1363 balls
Features
Processor hosts bus supports 667/800/1066MHz FSB support.
Supports Dual Channel DDR2 SDRAM at 667/800MHz
Integrated SDRAM controller up to 8GB (2 SODIMM support)
DMI x2 and DMI x4 for connection between GMCH and ICH9M
Item
Specification
Chipset
ICH9M SFF
Package
BGA 676 balls
Features
Upstream accelerated Hub architecture interface for access to
GMCH.
PCI Express Base Specification, Revivsion 1.1 support.
PCI 2.3 interface. (4 PCI Request/Grant pairs).
ACPI Power Management Logi Support.
Enhanced DMA controller, interupt controller, timers functions.
Integrated Serial ATA host controllers with independent DMA
operation on six ports and AHCI support.
USB 1.1 and USB 2.0 Host controllers.
Supports Intel High Definition Audio (Intel HD Audio) Interface.
Supports Intel® Matrix Storage Technology.
Supports Intel® Active Mangement Technology.
Low Pin Count (LPC) interface.
6 PCle ports.
Item
Specification
Memory size
0MB (No on-board Memory)
DIMM socket number
2 sockets
Supports memory size per socket
2GB
Supports maximum memory size
4GB for 64bit OS (with two 2GB SO-DIMM)
Supports DIMM type
DDR2 Synchronous DRAM
Supports DIMM Speed
800/667 MHz
Item
Specification
Chipset
Intel® GS45 Express Chipset
Package
1329-ball FCBGA
Size: 34mm x 34mm
Ball pitch: 0.7mm