Intel BLKDH61WWB3 Product Specification - Page 11

1 Product Description 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the board. Table 1. Feature Summary Form Factor Processor Chipset Memory Graphics Audio MicroATX (9.60 inches by 7.80 inches [243.84 millimeters by 198.12 millimeters]) • Intel® Core™ i7, Intel® Core™ i5, Intel® Core™ i3, and Intel® Pentium® processors in an LGA1155 socket with up to 95 W TDP: ― Integrated graphics processing (processors with Intel® Graphics Technology) ― External graphics interface controller ― Integrated memory controller Intel® H61 Express Chipset consisting of the Intel® H61 Platform Controller Hub (PCH) • Two 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets • Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs • Support for 1 Gb, 2 Gb, and 4 Gb memory technology • Support for up to 16 GB of system memory with two DIMMs using 4 Gb memory technology • Support for non-ECC memory • Integrated graphics support for processors with Intel® Graphics Technology • Discrete graphics support for PCI Express 2.0 x16 add-in graphics card • Intel® High Definition Audio: ― Realtek* ALC892 audio codec ― S/PDIF audio header ― Front panel audio header continued 11