Intel BLKDH61WWB3 Product Specification - Page 24

Audio Subsystem Software, Audio Headers and Connectors - drivers

Page 24 highlights

Intel Desktop Board DH61WW Technical Product Specification 1.11.1 Audio Subsystem Software Audio software and drivers are available from Intel's World Wide Web site. For information about Obtaining audio software and drivers Refer to Section 1.3, page 16 1.11.2 Audio Headers and Connectors The board contains audio connectors and headers on both the back panel and the component side of the board. The component-side audio headers include the following: • Front panel audio (a 2 x 5-pin header that provides headphone and mic in signals for front panel audio connectors) (yellow) • S/PDIF audio header (1 x 4-pin header) (yellow) For information about The locations of the front panel audio header, S/PDIF header, and internal mono speaker header The signal names of the front panel audio header The signal names of the S/PDIF header The back panel audio connectors Refer to Figure 10, page 42 Table 14 and Table 15, page 45 Table 13, page 44 Section 2.2.1, page 41 24

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Intel Desktop Board DH61WW Technical Product Specification
24
1.11.1
Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about
Refer to
Obtaining audio software and drivers
Section 1.3, page 16
1.11.2
Audio Headers and Connectors
The board contains audio connectors and headers on both the back panel and the
component side of the board.
The component-side audio headers include the
following:
Front panel audio (a 2 x 5-pin header that provides headphone and mic in signals
for front panel audio connectors) (yellow)
S/PDIF audio header (1 x 4-pin header) (yellow)
For information about
Refer to
The locations of the front panel audio header, S/PDIF header, and
internal mono speaker header
Figure 10, page 42
The signal names of the front panel audio header
Table 14 and Table 15, page 45
The signal names of the S/PDIF header
Table 13, page 44
The back panel audio connectors
Section 2.2.1, page 41