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Intel BLKDH61WWB3 Product Specification - Page 58

Reliability, Environmental

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Intel Desktop Board DH61WW Technical Product Specification 2.7 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332, Method I Case 1 50% electrical stress, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the board is 324,824 hours. 2.8 Environmental Table 29 lists the environmental specifications for the board. Table 29. Environmental Specifications Parameter Temperature Non-Operating Operating Shock Unpackaged Packaged Vibration Unpackaged Packaged Specification -40 °C to +60 °C 0 °C to +40 °C 50 g trapezoidal waveform Velocity change of 170 inches/second² Half sine 2 millisecond Product Weight (pounds) Free Fall (inches)

Section	Page
Intel® Desktop Board DH61WW Technical Product Specification	1
Revision History	2
Disclaimer	2
Board Identification Information	3
Specification Changes or Clarifications	3
Errata	4
Preface	5
Intended Audience	5
What This Document Contains	5
Typographical Conventions	5
Contents	7
1 Product Description	11
1.1 Overview	11
1.1.1 Feature Summary	11
1.1.2 Board Layout	13
1.1.3 Block Diagram	15
1.2 Legacy Considerations	16
1.3 Online Support	16
1.4 Processor	16
1.5 Intel® H61 Express Chipset	17
1.6 System Memory	17
1.6.1 Memory Configurations	18
1.7 Graphics Subsystem	20
1.7.1 Integrated Graphics	20
1.7.2 PCI Express x16 Graphics	20
1.8 USB	21
1.9 SATA Interfaces	21
1.10 Legacy I/O Controller	22
1.10.1 Serial Port	22
1.11 Audio Subsystem	23
1.11.1 Audio Subsystem Software	24
1.11.2 Audio Headers and Connectors	24
1.12 LAN Subsystem	26
1.12.1 Intel® 82579V Gigabit Ethernet Controller	26
1.12.2 LAN Subsystem Software	26
1.12.3 RJ-45 LAN Connector with Integrated LEDs	27
1.13 Real-Time Clock Subsystem	28
1.14 Thermal Monitoring	29
1.15 Platform Management and Security	30
1.15.1 Hardware Management Subsystem	30
1.15.2 Hardware Monitoring	30
1.16 Power Management	31
1.16.1 ACPI	31
1.16.2 Hardware Support	34
2 Technical Reference	38
2.1 Memory Resources	38
2.1.1 Addressable Memory	38
2.1.2 Memory Map	40
2.2 Connectors and Headers	40
2.2.1 Back Panel Connectors	41
2.2.2 Component-side Connectors and Headers	42
2.3 BIOS Configuration Jumper Block	51
2.4 Mechanical Considerations	53
2.4.1 Form Factor	53
2.5 Electrical Considerations	54
2.5.1 Power Supply Considerations	54
2.5.2 Fan Header Current Capability	55
2.5.3 Add-in Board Considerations	55
2.6 Thermal Considerations	56
2.7 Reliability	58
2.8 Environmental	58
3 Overview of BIOS Features	59
3.1 Introduction	59
3.2 System Management BIOS (SMBIOS)	61
3.3 Legacy USB Support	61
3.4 BIOS Updates	62
3.4.1 Language Support	62
3.4.2 Custom Splash Screen	63
3.5 BIOS Recovery	63
3.6 Boot Options	64
3.6.1 Optical Drive Boot	64
3.6.2 Network Boot	64
3.6.3 Booting Without Attached Devices	64
3.6.4 Changing the Default Boot Device During POST	64
4 Error Messages and Beep Codes	65
4.1 Speaker	65
4.2 BIOS Beep Codes	65
4.3 Front-panel Power LED Blink Codes	66
4.4 BIOS Error Messages	66
4.5 Port 80h POST Codes	67
5 Regulatory Compliance and Battery Disposal Information	73
5.1 Regulatory Compliance	73
5.1.1 Safety Standards	73
5.1.2 European Union Declaration of Conformity Statement	74
5.1.3 Product Ecology Statements	75
5.1.4 EMC Regulations	77
5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance	80
5.1.6 Regulatory Compliance Marks (Board Level)	81