Intel DG33TL Product Specification - Page 5

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Contents 1 Product Description 1.1 Overview 10 1.1.1 Feature Summary 10 1.1.2 Board Layout 12 1.1.3 Block Diagram 14 1.2 Legacy Considerations 15 1.3 Online Support 15 1.4 Processor 15 1.5 System Memory 16 1.5.1 Memory Configurations 17 1.6 Intel® G33 Express Chipset 19 1.6.1 Intel G33 Graphics Subsystem 19 1.6.2 Intel® Viiv™ Processor Technology 21 1.6.3 USB 21 1.6.4 Serial ATA Interfaces 22 1.7 Parallel IDE Controller 23 1.8 Real-Time Clock Subsystem 23 1.9 Legacy I/O Controller 24 1.9.1 Consumer Infrared (CIR 24 1.9.2 Serial Port 24 1.10 Audio Subsystem 25 1.10.1 Audio Subsystem Software 26 1.10.2 Audio Connectors and Headers 26 1.11 LAN Subsystem 27 1.11.1 Intel® 82566DC Gigabit Ethernet Controller 27 1.11.2 LAN Subsystem Software 28 1.11.3 RJ-45 LAN Connector with Integrated LEDs 28 1.12 Hardware Management Subsystem 29 1.12.1 Hardware Monitoring and Fan Control 29 1.12.2 Fan Monitoring 29 1.12.3 Chassis Intrusion and Detection 29 1.12.4 Thermal Monitoring 30 1.13 Power Management 31 1.13.1 ACPI 31 1.13.2 Hardware Support 34 2 Technical Reference 2.1 Memory Map 39 2.1.1 Addressable Memory 39 2.2 Connectors and Headers 42 2.2.1 Back Panel Connectors 43 2.2.2 Component-side Connectors and Headers 44 v

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v
Contents
1
Product Description
1.1
Overview
........................................................................................
10
1.1.1
Feature Summary
................................................................
10
1.1.2
Board Layout
.......................................................................
12
1.1.3
Block Diagram
.....................................................................
14
1.2
Legacy Considerations
......................................................................
15
1.3
Online Support
................................................................................
15
1.4
Processor
.......................................................................................
15
1.5
System Memory
..............................................................................
16
1.5.1
Memory Configurations
.........................................................
17
1.6
Intel
®
G33 Express Chipset
...............................................................
19
1.6.1
Intel G33 Graphics Subsystem
...............................................
19
1.6.2
Intel
®
Viiv™ Processor Technology
..........................................
21
1.6.3
USB
...................................................................................
21
1.6.4
Serial ATA Interfaces
............................................................
22
1.7
Parallel IDE Controller
......................................................................
23
1.8
Real-Time Clock Subsystem
..............................................................
23
1.9
Legacy I/O Controller
.......................................................................
24
1.9.1
Consumer Infrared (CIR)
.......................................................
24
1.9.2
Serial Port
...........................................................................
24
1.10
Audio Subsystem
.............................................................................
25
1.10.1
Audio Subsystem Software
....................................................
26
1.10.2
Audio Connectors and Headers
...............................................
26
1.11
LAN Subsystem
...............................................................................
27
1.11.1
Intel
®
82566DC Gigabit Ethernet Controller
..............................
27
1.11.2
LAN Subsystem Software
.......................................................
28
1.11.3
RJ-45 LAN Connector with Integrated LEDs
..............................
28
1.12
Hardware Management Subsystem
....................................................
29
1.12.1
Hardware Monitoring and Fan Control
......................................
29
1.12.2
Fan Monitoring
.....................................................................
29
1.12.3
Chassis Intrusion and Detection
..............................................
29
1.12.4
Thermal Monitoring
..............................................................
30
1.13
Power Management
.........................................................................
31
1.13.1
ACPI
..................................................................................
31
1.13.2
Hardware Support
................................................................
34
2
Technical Reference
2.1
Memory Map
...................................................................................
39
2.1.1
Addressable Memory
.............................................................
39
2.2
Connectors and Headers
...................................................................
42
2.2.1
Back Panel Connectors
..........................................................
43
2.2.2
Component-side Connectors and Headers
................................
44