Xerox 3450B Service Manual - Page 7

Electrostatic Discharge (ESD) Precautions

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Electrostatic Discharge (ESD) Precautions Some semiconductor components, and the respective sub-assemblies that contain them, are vulnerable to damage by Electrostatic discharge (ESD). These components include Integrated Circuits (ICs), Large-Scale Integrated circuits (LSIs), field-effect transistors and other semiconductor chip components. The following techniques will reduce the occurrence of component damage caused by static electricity. Be sure the power to the chassis or circuit board is off, and observe all other safety precautions. ■ Before handling any semiconductor components assemblies, drain the electrostatic charge from your body. This can be accomplished by touching an earth ground source or by wearing a wrist strap device connected to an earth ground source. Wearing a wrist strap will also prevent accumulation of additional bodily static charges. Be sure to remove the wrist strap before applying power to the unit to avoid potential shock. ■ After removing a static sensitive assembly from its anti-static bag, place it on a grounded conductive surface. If the anti-static bag is conductive, you may ground the bag and use it as a conductive surface. ■ Do not use freon-propelled chemicals, as they can generate electrical charges that may damage some devices. ■ Do not remove a static sensitive replacement component or electrical subassembly from its protective package until you are ready to install it. ■ Before removing the protective material from the leads of a replacement device, touch the protective material to the chassis or circuit assembly into which the device will be installed. ■ Minimize body motions when handling unpackaged replacement devices. Simple motions such as your clothes brushing together or lifting a foot from a carpeted floor can generate enough static electricity to damage a static sensitive device ■ Handle IC's and EPROM's carefully to avoid bending pins. ■ Pay attention to the direction of parts when mounting or inserting them on Printed Circuit Boards (PCB's). vi Phaser 3450 Laser Printer

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Phaser 3450 Laser Printer
Electrostatic Discharge (ESD) Precautions
Some semiconductor components, and the respective sub-assemblies that contain
them, are vulnerable to damage by Electrostatic discharge (ESD). These components
include Integrated Circuits (ICs), Large-Scale Integrated circuits (LSIs), field-effect
transistors and other semiconductor chip components. The following techniques will
reduce the occurrence of component damage caused by static electricity.
Be sure the power to the chassis or circuit board is off, and observe all other safety
precautions.
■
Before handling any semiconductor components assemblies, drain the
electrostatic charge from your body. This can be accomplished by touching an
earth ground source or by wearing a wrist strap device connected to an earth
ground source. Wearing a wrist strap will also prevent accumulation of additional
bodily static charges. Be sure to remove the wrist strap before applying power to
the unit to avoid potential shock.
■
After removing a static sensitive assembly from its anti-static bag, place it on a
grounded conductive surface. If the anti-static bag is conductive, you may ground
the bag and use it as a conductive surface.
■
Do not use freon-propelled chemicals, as they can generate electrical charges that
may damage some devices.
■
Do not remove a static sensitive replacement component or electrical sub-
assembly from its protective package until you are ready to install it.
■
Before removing the protective material from the leads of a replacement device,
touch the protective material to the chassis or circuit assembly into which the
device will be installed.
■
Minimize body motions when handling unpackaged replacement devices. Simple
motions such as your clothes brushing together or lifting a foot from a carpeted
floor can generate enough static electricity to damage a static sensitive device
■
Handle IC’s and EPROM’s carefully to avoid bending pins.
■
Pay attention to the direction of parts when mounting or inserting them on
Printed Circuit Boards (PCB’s).