Asus M4A78T-E User Manual - Page 33
DDR3-1333 MHz capability, DDR3-1066 MHz capability - bios chip
UPC - 610839169559
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Chapter 2 DDR3-1333 MHz capability Vendor Part No. Size KINGMAX FLFD45F-B8EE9 KINGSTON KVR1333D3N9/1G KINGSTON KVR1333D3N9/2G MICRON MT8JTF12864AY-1G4BYES MICRON MT16JTF25664AY-1G4BYES OCZ OCZ3RPX1333EB2GK OCZ OCZ3G13334GK OCZ OCZ3P13334GK OCZ OCZ3RPX1333EB4GK Qimonda IMSH1GU03A1F1C-13H Qimonda IMSH2GU13A1F1C-13H SAMSUNG M378B2873DZ1-CH9 SAMSUNG M391B2873DZ1-CH9 SAMSUNG M378B5673DZ1-CH9 SAMSUNG M391B5673DZ1-CH9 Transcend TS128MLK64V3U Transcend TS256MLK64V3U Aeneon AEH760UD00-13H Asint SLY3128M8-EDJ Asint SLZ3128M8-EDJ ASUS N/A BUFFALO FSX1333D3G-1G BUFFALO FSX1333D3G-2G Elixir M2F2G64CB8HA4N-CG Patriot PDC32G1333LLK Patriot PVT33G1333ELK Patriot PVT36G1333ELK 1024MB 1024MB 2048MB 1024MB 2048MB 1024MB 4096MB (Kit of 2) 4096MB (Kit of 2) 4096MB (Kit of 2) 1024MB 2048MB 1024MB 1024MB 2048MB 2048MB 1024MB 2048MB 1024MB 1024MB 2048MB 1024MB 1024MB 2048MB 2048MB 1024MB 3072MB (Kit of 3) 6144MB (Kit of 3) SS/ DS Chip Brand Chip NO. Timing Dimm (Bios) SS ELPIDA SS ELPIDA DS ELPIDA SS MICRON DS MICRON SS N/A DS N/A J1108BASE-DJ-E J1108BASE-DJ-E J1108BASE-DJ-E Z9HWR Z9HWR Heat-Sink Package Heat-Sink Package (1333-9-9-9-24) (1333-9-9-9-24) (1333-9-9-9-24) (1333-9-9-9-24) (1333-9-9-9-24) (1066-6-5-5-20) 9(1066-8-9-9-20) DIMM socket Voltage support (Optional) A* B* C* •• • 1.5 •• • 1.5 •• • •• • •• • • 1.7 •• • DS N/A Heat-Sink Package 7(1333-7-7-7-20) 1.8 •• • DS N/A Heat-Sink Package (1066-6-5-5) 1.85 • SS Qimonda IDSH1G-03A1F1C-13H 9(1333-9-9-9-24) DS Qimonda IDSH1G-03A1F1C-13H 9(1333-9-9-9-24) SS SAMSUNG K4B1G0846D 9(1333-9-9-9-24) SS SAMSUNG K4B1G0846D(ECC) 9(1333-9-9-9-24) DS SAMSUNG K4B1G0846D 9(1333-9-9-9-24) DS SAMSUNG K4B1G0846D(ECC) 9(1333-9-9-9-24) SS SAMSUNG K4B1G0846D 9(1333-9-9-9-24) DS SAMSUNG K4B1G0846D 9(1333-9-9-9-24) DS AENEON AEH93R13H (1333-9-9-9-24) SS Asint DDRIII1208-DJ (9-9-9-24) DS Asint DDRIII1208-DJ (9-9-9-24) DS N/A Heat-Sink Package (1333-9-9-9-24) SS N/A Heat-Sink Package (1066-7-7-7-20) DS N/A Heat-Sink Package (1066-7-7-7-20) DS Elixir N2CB1G80AN-CG (1333-9-9-9-24) SS PATRIOT Heat-Sink Package 7(1337-7-7-7-20) 1.7 SS N/A Heat-Sink Package 9-9-9-24(1066-7-7-7-20) 1.65 DS N/A Heat-Sink Package 9-9-9-24(1066-7-7-7-20) 1.65 • • • DDR3-1066 MHz capability Vendor Part No. Size SS/ Chip DS Brand Chip NO. Timing Dimm (Bios) CORSAIR Crucial Crucial Crucial ELPIDA ELPIDA G.SKILL CM3X1024-1066C7 CT12864BA1067.8SFB CT12864BA1067.8SFD CT25664BA1067.16SFD EBJ10UE8BAW0-AE-E EBJ21UE8BAW0-AE-E F3-8500CL6D-2GBHK Hynix Hynix Hynix Hynix KINGSTON KINGSTON MICRON MICRON Qimonda HMT112U6AFP8C-G7N0 HYMT112U64ZNF8-G7 HMT125U6AFP8C-G7N0 HYMT125U64ZNF8-G7 KVR1066D3N7/1G KVR1066D3N7/2G MT8JTF12864AY-1G1D1 MT16JTF25664AY-1G1D1 IMSH1GU03A1F1C-10F 1024MB DS N/A Heat-Sink Package 7 1024MB SS MICRON Z9HWQ 7 1024MB SS MICRON D9JNL 7 2048MB DS MICRON D9JNL 7 1024MB SS ELPIDA J1108BABG-DJ-E 7(1066-7-7-7-20) 2048MB DS ELPIDA J1108BABG-DJ-E 7(1066-7-7-7-20) 2048MB SS N/A (Kit of 2) Heat-Sink Package 6-6-6-15 1024MB SS HYNIX H5TQ1G83AFPG7C 7 1024MB SS HYNIX HY5TQ1G831ZNFP-G7 7 2048MB DS HYNIX H5TQ1G83AFPG7C 7 2048MB DS HYNIX HY5TQ1G831ZNFP-G7 7 1024MB DS ELPIDA J5308BASE-AC-E 2048MB DS SAMSUNG K4B1G0846C-ZCF8 1024MB SS MICRON 7VD22 7 2048MB DS MICRON 7VD22 7 1024MB SS Qimonda IDSH1G-03A1F1C-10F 7 Voltage 1.1 1.65 DIMM socket support (Optional) A* B* C • •• • •• • •• • •• 1.5 • •• 1.5 •• • •• • •• • •• ASUS M4A78T-E 2-13