HP OMEN 15-ce100 Maintenance and Service Guide - Page 64
board components each time the heat sink is removed. Thermal paste is used on the processor
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2. Remove the heat sink (2). NOTE: Due to the adhesive quality of the thermal material located between the heat sink and the system board components, it may be necessary to move the heat sink from side to side to detach it. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Thermal paste is used on the processor (1), the graphics processor (3), and the heat sink sections (2 and 4) that service the processors. 54 Chapter 6 Removal and replacement procedures for authorized service provider parts
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2.
Remove the heat sink
(2)
.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink and the
system board components, it may be necessary to move the heat sink from side to side to detach it.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Thermal paste is used on the processor
(1)
, the
graphics processor
(3)
, and the heat sink sections
(2 and 4)
that service the processors.
54
Chapter 6
Removal and replacement procedures for authorized service provider parts