HP Pavilion 14-al000 Maintenance and Service Guide - Page 57

illustration shows the thermal material locations on a computer model equipped with a graphics subsystem

Get HP Pavilion 14-al000 PDF manuals and user guides View all HP Pavilion 14-al000 manuals
Add to My Manuals
Save this manual to your list of manuals

Page 57 highlights

4. Remove the heat sink (2). NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board each time the heat sink is removed. Thermal material is used on the processor (1) and the heat sink section (2) that services it. Thermal material is also used on the graphics subsystem chip (3) and the heat sink section (4) that services it. The following illustration shows the thermal material locations on a computer model equipped with a graphics subsystem with discrete memory. Thermal material is used on the processor (1) and the heat sink section (2) that services it. The following illustration shows the thermal material locations on a computer model equipped with a graphics subsystem with UMA memory. Component replacement procedures 49

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
4.
Remove the heat sink
(2)
.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board each time the heat sink is removed.
Thermal material is used on the processor
(1)
and the heat sink section
(2)
that services it. Thermal material
is also used on the graphics subsystem chip
(3)
and the heat sink section
(4)
that services it. The following
illustration shows the thermal material locations on a computer model equipped with a graphics subsystem
with discrete memory.
Thermal material is used on the processor
(1)
and the heat sink section
(2)
that services it. The following
illustration shows the thermal material locations on a computer model equipped with a graphics subsystem
with UMA memory.
Component replacement procedures
49