HP Stream 11-y000 Maintenance and Service Guide - Page 45

Heat sink, The thermal material must be thoroughly cleaned from the surfaces of the heat sink

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Heat sink Description Heat sink (includes replacement thermal material) for use in HP Stream models and Pro G3 models Heat sink (includes replacement thermal material) for use on Pro G4 Education Edition models and Pro G5 models Spare part number 902899-001 L02781-001 Before removing the heat sink, follow these steps: 1. Prepare the computer for disassembly (Preparation for disassembly on page 26). 2. Remove the computer feet (see Computer feet on page 26). 3. Remove the keyboard/top cover (see Keyboard/top cover on page 28). 4. Remove the speakers (see Speakers on page 31). 5. Remove the battery (see Battery on page 34). Remove the heat sink: 1. Remove the two Phillips M2.0 × 2.2 broad head screws (1) that secure the heat sink to the system board. 2. Remove the heat sink (2). NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Thermal paste is used on the processor (1) and the heat sink section (2) that services it. Component replacement procedures 37

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Heat sink
Description
Spare part number
Heat sink (includes replacement thermal material) for use in HP Stream models and Pro G3 models
902899-001
Heat sink (includes replacement thermal material) for use on Pro G4 Education Edition models and Pro
G5 models
L02781-001
Before removing the heat sink, follow these steps:
1.
Prepare the computer for disassembly (
Preparation for disassembly
on page
26
).
2.
Remove the computer feet (see
Computer feet
on page
26
).
3.
Remove the keyboard/top cover (see
Keyboard/top cover
on page
28
).
4.
Remove the speakers (see
Speakers
on page
31
).
5.
Remove the battery (see
Battery
on page
34
).
Remove the heat sink:
1.
Remove the two Phillips M2.0 × 2.2 broad head screws
(1)
that secure the heat sink to the system board.
2.
Remove the heat sink
(2)
.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink
and the system board components each time the heat sink is removed. Thermal paste is used on
the processor
(1)
and the heat sink section
(2)
that services it.
Component replacement procedures
37