Intel D845HV Product Specification - Page 32
Audio Subsystem Optional
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Intel Desktop Board D845HV/D845WN Technical Product Specification 1.10 Audio Subsystem (Optional) The optional audio subsystem includes these features: • Split digital/analog architecture for improved S/N (signal-to-noise) ratio: ≥ 85 dB • Power management support for ACPI 1.0 (driver dependant) • 3-D stereo enhancement • Mic in pre-amp that supports dynamic, condenser, and electret microphones The audio subsystem supports the following audio interfaces: • ATAPI-style connectors: Telephony Auxiliary line in CD-ROM • Front panel audio connector, including pins for: Line out Mic in • Back panel audio connectors: Line out Line in Mic in The audio subsystem consists of the following devices: • Intel 82801BA I/O Controller Hub (ICH2) • Analog Devices AD1885 audio codec Figure 7 is a block diagram of the audio subsystem. 82801BA I/O Controller Hub (ICH2) AC '97 Link AD1885 Audio Codec Line In Line Out Mic In Auxiliary Line In CD-ROM Telephony Figure 7. Audio Subsystem Block Diagram OM12276 For information about Upgrading the onboard audio subsystem using a CNR audio card The front panel audio connector The back panel audio connectors Refer to Section 1.12, page 35 Section 2.8.3, page 68 Section 2.8.1, page 52 32