Intel S975XBX2 Product Specification - Page 31

Audio Subsystem - audio drivers

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Product Description 1.10 Audio Subsystem The board supports the Intel High Definition audio subsystem based on the SigmaTel 9227 audio codec. The audio subsystem supports the following features: • Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize the device that is connected to an audio port. The back panel audio jacks are capable of retasking according to user's definition, or can be automatically switched depending on the recognized device type. • Stereo input and output for all back panel jacks • Line out and Mic in functions for front panel audio jacks • A signal-to-noise (S/N) ratio of 90 dB 1.10.1 Audio Subsystem Software Audio software and drivers are available from Intel's World Wide Web site. For information about Refer to Obtaining audio software and drivers Section 1.2, page 17 1.10.2 Audio Connectors The board contains audio connectors and headers on both the back panel and the component side of the board. The component-side audio connectors include the following: • Front panel audio (a 2 x 5-pin header that provides mic in and line out signals for front panel audio connectors) • ATAPI CD-ROM (an optional 1 x 4-pin ATAPI-style connector for connecting an internal ATAPI CD-ROM drive to the audio mixer) The 6-channel (5.1) audio subsystem is described in Section 1.10.3. For information about The locations of the front panel audio header and the optional ATAPI CD-ROM connector The signal names of the front panel audio header The signal names of the optional ATAPI CD-ROM connector The back panel audio connectors Refer to Figure 16, page 56 Table 18, page 58 Table 17, page 58 Section 2.7.1, page 54 31

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Product Description
31
1.10
Audio Subsystem
The board supports the Intel High Definition audio subsystem based on the
SigmaTel 9227 audio codec.
The audio subsystem supports the following features:
•
Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port.
The back panel audio
jacks are capable of retasking according to user’s definition, or can be
automatically switched depending on the recognized device type.
•
Stereo input and output for all back panel jacks
•
Line out and Mic in functions for front panel audio jacks
•
A signal-to-noise (S/N) ratio of 90 dB
1.10.1
Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about
Refer to
Obtaining audio software and drivers
Section 1.2, page 17
1.10.2
Audio Connectors
The board contains audio connectors and headers on both the back panel and the
component side of the board.
The component-side audio connectors include the
following:
•
Front panel audio (a 2 x 5-pin header that provides mic in and line out signals for
front panel audio connectors)
•
ATAPI CD-ROM (an optional 1 x 4-pin ATAPI-style connector for connecting an
internal ATAPI CD-ROM drive to the audio mixer)
The 6-channel (5.1) audio subsystem is described in Section 1.10.3.
For information about
Refer to
The locations of the front panel audio header and the optional ATAPI
CD-ROM connector
Figure 16, page 56
The signal names of the front panel audio header
Table 18, page 58
The signal names of the optional ATAPI CD-ROM connector
Table 17, page 58
The back panel audio connectors
Section 2.7.1, page 54