Intel S975XBX2 Product Specification - Page 74
Reliability
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Intel Workstation Board S975XBX2 Technical Product Specification Table 35 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 35. Thermal Considerations for Components Component Intel 82801G ICH7-R/ICH7-DH Intel 82975X MCH Processor Processor voltage regulator area Temperature 110 oC (under bias) 99 oC (under bias) For processor case temperature, see processor datasheets and processor specification updates 120 oC (under bias) NOTE For hardware monitoring application software, an alert point of 110 oC is recommended as a starting point for the processor voltage regulator area. For information about Intel Pentium 4 processor datasheets and specification updates Refer to Section 1.2, page 17 2.12 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the board is 99,721 hours. 74