Intel SR1530HCLS Product Specification - Page 23

Power Supply Fans, 3.2 Processor Air Duct and Air Baffle

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Intel® Server Systems SR1530CL/SR1530HCL/SR1530HCS and SR1530CLR/SR1530HCLR/SR1530HCLSR Cooling Sub-System A B AF001648 Figure 11. Fan Module Assembly - SR1530HCL/SR1530HCLR (SATA) and SR1530HCLS/SR1530HCLSR (SAS) Fan System fan blower 1 System fan blower 2 PCI cooling fan (SR1530CL only) Table 14. Cooling Zones Cooling Zone CPU1 CPU2 PCI Greatest Cooling Influence Primary cooling for CPU1 and the system memory Primary cooling for hard HDD1, CPU2, the MCH, and the low-profile PCI cards Primary cooling for HDD0, full-height PCI cards, PXH and the IOP80333 chipset 3.1 Power Supply Fans The power supply supports two non-redundant 40 mm fans. They are responsible for the cooling of the power supply, first hard drive bay, and slimline drive bay. 3.2 Processor Air Duct and Air Baffle The system requires the use of a processor air duct and power supply/electronics bay isolation air baffle to direct airflow and sustain appropriate air pressure. An air baffle isolates the air flow of the two power supply fans from that of the system fan module. The baffle is mounted into three stand-offs with one end fitting under the back edge of the hard drive bay. Revision 2.2 15 Intel order number D71005-005

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Intel® Server Systems SR1530CL/SR1530HCL/SR1530HCS
Cooling Sub-System
and SR1530CLR/SR1530HCLR/SR1530HCLSR
Revision 2.2
Intel order number D71005-005
15
B
A
AF001648
Figure 11. Fan Module Assembly - SR1530HCL/SR1530HCLR (SATA) and
SR1530HCLS/SR1530HCLSR (SAS)
Table 14. Cooling Zones
Fan
Cooling
Zone
Greatest Cooling Influence
System fan blower 1
CPU1
Primary cooling for CPU1 and the system memory
System fan blower 2
CPU2
Primary cooling for hard HDD1, CPU2, the MCH, and the
low-profile PCI cards
PCI cooling fan
(SR1530CL only)
PCI
Primary cooling for HDD0, full-height PCI cards, PXH and
the IOP80333 chipset
3.1
Power Supply Fans
The power supply supports two non-redundant 40 mm fans. They are responsible for the
cooling of the power supply, first hard drive bay, and slimline drive bay.
3.2
Processor Air Duct and Air Baffle
The system requires the use of a processor air duct and power supply/electronics bay isolation
air baffle to direct airflow and sustain appropriate air pressure.
An air baffle isolates the air flow of the two power supply fans from that of the system fan
module. The baffle is mounted into three stand-offs with one end fitting under the back edge of
the hard drive bay.