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Intel SR1530HCLS Product Specification - Page 47

European Directive 2002/95/EC, German Green Dot, ISO11469, Japan Recycling

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Intel® Server Systems SR1530CL/SR1530HCL/SR1530HCS and SR1530CLR/SR1530HCLR/SR1530HCLSR Environmental and Regulatory Specifications Compliance Regional Description Compliance Reference European Directive 2002/95/EC Restriction of Hazardous Substances (RoHS) Threshold limits and banned substances are noted below. Quantity limit of 0.1% by mass (1000 PPM) for: Lead, Mercury, Hexavalent Chromium, Polybrominated Biphenyls Diphenyl Ethers (PBB/PBDE) Quantity limit of 0.01% by mass (100 PPM) for: Cadmium Compliance Reference Marking Example None Required Germany German Green Dot Applied to Retail Packaging Only for Boxed Boards Intel Internal Specification All materials, parts and subassemblies must not contain restricted materials as defined in Intel's Environmental Product Content Specification of Suppliers and Outsourced Manufacturers - http://supplier.intel.com/ehs/environmental.htm None Required International ISO11469 - Plastic parts weighing >25gm are intended to be marked with per ISO11469. >PC/ABS< Recycling Markings - Fiberboard (FB) and Cardboard (CB) are marked with international recycling marks. Applied to outer bulk packaging and single package. Japan Japan Recycling Applied to Retail Packaging Only for Boxed Boards Revision 2.2 39 Intel order number D71005-005

Section	Page
1. Introduction	9
1.1 System Views	9
1.2 System Dimensions	10
1.3 System Components	11
1.4 System Boards	13
1.5 Hard Drive and Peripheral Bays	13
1.6 Power Sub-System	15
1.7 System Cooling	15
1.8 Rack and Cabinet Mounting Options	15
2. Power Sub-System	16
2.1 Mechanical Overview	16
2.2 Output Connectors	17
2.2.1 P1 – Main Power Connector	17
2.2.2 P2 – Processor Power Connector	18
2.2.3 P3 – Baseboard Signal Connector	18
2.2.4 P4 and P5 – SATA Hard Drive Power Connectors	18
2.2.5 P6 – CD Power Connector	19
2.2.6 P7 – HSBP Power Connector	19
2.3 Efficiency	19
2.4 AC Input Voltage Requirement	19
2.5 Protection Circuits	20
2.5.1 Over-current Protection (OCP)	20
2.5.2 Over-voltage Protection (OVP)	20
2.5.3 Over-temperature Protection (OTP)	21
2.6 AC Power Cord Specification Requirements	21
3. Cooling Sub-System	22
3.1 Power Supply Fans	23
3.2 Processor Air Duct and Air Baffle	23
4. Peripheral and Hard Drive Support	25
4.1 Optical Drive Support	26
4.1.1 Optical Drive Support	26
4.2 Hard Disk Drive Support	27
4.2.1 Hot-Swap Hard Disk Drive Trays	27
4.2.2 Drive Blanks	28
4.2.3 System Fan Connectors	29
5. Front Control Panel	30
5.1.1 Power/Sleep LED	32
5.1.2 System Status LED	32
5.1.3 Drive Activity LED	33
6. PCI Riser Cards and Assembly	34
7. Backplane Board	35
7.1.1 Hard Drive Activity LED	37
8. Supported Intel® Server Boards	38
8.1 Intel® Server Board S5000VCL Feature Set	38
9. Environmental and Regulatory Specifications	39
9.1 System Level Environmental Limits	39
9.2 Serviceability and Availability	39
9.3 Replacing the CMOS Battery	40
9.4 Product Regulatory Compliance	41
9.5 Use of Specified Regulated Components	41
9.6 Electromagnetic Compatibility Notices	43
9.6.1 USA	43
9.6.2 FCC Verification Statement	44
9.6.3 ICES-003 (Canada)	44
9.6.4 Europe (CE Declaration of Conformity)	44
9.6.5 Japan EMC Compatibility	44
9.6.6 BSMI (Taiwan)	45
9.6.7 RRL (Korea)	45
9.7 Product Ecology Compliance	46
9.8 Other Markings	48
Appendix A: Integration and Usage Tips	49
Appendix B: POST Code Diagnostic LED Decoder	50
Appendix C: POST Error Beep Codes	54
Glossary	54