Sony HCD-ZUX9 Service Manual - Page 42

HCD-ZUX9 • Note for Printed Wiring Boards and Schematic Diagrams Note on Printed Wiring Board: • X : parts extracted from the component side. • Y : parts extracted from the conductor side. • : Pattern from the side which enables seeing. (The other layer's patterns are not indicated.) Caution: Pattern face side: (Conductor Side) Parts face side: (Component Side) Parts on the pattern face side seen from the pattern face are indicated. Parts on the parts face side seen from the parts face are indicated. • Indication of transistor C Q These are omitted. BE D Q These are omitted. GS Q BCE These are omitted. Q BCE These are omitted. • Abbreviation AUS : Australian model E2 : 120 V AC area in E model E13 : 220-230 V AC area in E model E51 : Chilean and Peruvian model Note on Schematic Diagram: • All capacitors are in µF unless otherwise noted. (p: pF) 50 WV or less are not indicated except for electrolytics and tantalums. • All resistors are in Ω and 1/4 W or less unless otherwise specified. • 2 : nonflammable resistor. • C : panel designation. Note: The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified. • A : B+ Line. • B : B- Line. • Voltage and waveforms are dc with respect to ground under no-signal (detuned) conditions. no mark : TUNER ( ) : TAPE PLAY [ ] : TAPE REC < > : CD PLAY ∗ : Impossible to measure • Voltages are taken with a VOM (Input impedance 10 MΩ). Voltage variations may be noted due to normal produc- tion tolerances. • Waveforms are taken with a oscilloscope. Voltage variations may be noted due to normal produc- tion tolerances. • Circled numbers refer to waveforms. • Signal path. F : TUNER E : TAPE PLAY (DECK A) d : TAPE PLAY (DECK B) G : TAPE REC (DECK B) J : CD PLAY (ANALOG OUT) c : CD PLAY (DIGITAL OUT) N : MIC • Abbreviation AUS : Australian model E2 : 120 V AC area in E model E13 : 220-230 V AC area in E model E51 : Chilean and Peruvian model UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. • Unleaded solder melts at a temperature about 40 ˚C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 ˚C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! • Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. • Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. HCD-ZUX9 42 42 • Semiconductor Location (MAIN Borad) Ref. No. Location Ref. No. Location Ref. No. D102 D103 D105 D150 D205 D207 D224 D257 D270 D272 D530 D545 D549 D550 D551 D554 D555 D556 D557 D558 D560 D561 D600 D601 D602 IC100 IC120 IC151 IC152 IC153 IC200 IC201 IC202 IC325 A-5 A-5 E-6 A-5 B-5 B-7 A-6 B-7 B-5 B-5 H-6 F-6 E-9 E-9 E-9 F-4 F-4 F-4 G-5 G-6 H-3 G-3 F-12 F-12 F-12 C-5 B-6 C-4 C-3 D-3 C-10 H-10 B-5 D-8 IC500 G-8 IC501 G-9 IC550 H-6 IC551 H-6 IC554 F-3 IC555 F-3 IC556 F-5 Q101 E-6 Q150 D-3 Q170 D-4 Q171 D-4 Q172 D-4 Q201 B-8 Q202 B-8 Q203 B-9 Q204 C-8 Q205 B-7 Q206 B-7 Q207 B-7 Q208 B-7 Q242 A-8 Q243 A-8 Q244 B-8 Q245 C-9 Q246 C-8 Q247 C-8 Q248 C-8 Q249 C-9 Q251 C-8 Q252 B-8 Q253 C-8 Q254 C-8 Q255 B-7 Q256 B-7 Q270 Q300 Q301 Q302 Q305 Q306 Q350 Q351 Q352 Q373 Q400 Q401 Q430 Q450 Q451 Q480 Q500 Q501 Q502 Q527 Q528 Q529 Q530 Q545 Q546 Q547 Q551 Q557 Q600 Q601 Q602 Q603 Q604 Location B-5 B-9 D-10 D-11 D-11 C-10 A-10 D-11 D-10 C-11 I-11 H-9 H-8 I-11 H-9 H-8 H-9 G-8 G-8 H-7 H-8 H-8 H-8 F-6 F-6 G-6 E-9 G-6 F-12 F-12 F-12 F-12 E-12