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Do not disassemble the LCD module. Disassembly can cause malfunctions., If you transport the module

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Appendix A Handling the LCD Module Appendices 9. Do not disassemble the LCD module. Disassembly can cause malfunctions. 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxime). These materials can release gas that can damage the panel's polarization. Satellite A40 Maintenance Manual (960-458) A-5

Section	Page
Table of Contents	6
Chapter 1 Hardware Overview	12
1.1 Features	17
1.2 System Unit Block Diagram	23
1.3 USB 3.5-inch Floppy Disk Drive	29
1.4 2.5-inch Hard Disk Drive	30
1.5 DVD-ROM Drive	35
1.6 CD-RW/DVD-ROM Drive	37
1.7 DVD-R/-RW Drive	40
1.8 DVD±RW (DVD Dual) Drive	42
1.9 DVD-Multi (CD-R/RW DVD-RAM/R/RW) Drive	44
1.10 Keyboard	46
1.11 TFT Color Display	47
1.12 Power Supply	49
1.13 Batteries	51
Chapter 2 Troubleshooting Procedures	54
2.1 Troubleshooting	60
2.2 Troubleshooting Flowchart	61
2.3 Power Supply Troubleshooting	65
2.4 System Board Troubleshooting	77
2.5 FDD Troubleshooting	94
2.6 HDD Troubleshooting	97
2.7 Keyboard Troubleshooting	102
2.8 Display Troubleshooting	104
2.9 Optical Drive Troubleshooting	107
2.10 Modem Troubleshooting	109
2.11 LAN Troubleshooting	111
2.12 Wireless LAN Troubleshooting	112
2.13 Sound Troubleshooting	116
2.14 SD Card Slot Troubleshooting	119
Chapter 3 Tests and Diagnostics	121
3.1 The Diagnostic Test	125
3.2 Executing the Diagnostic Test	127
3.3 Subtest Names	132
3.4 System Test	134
3.5 Memory Test	138
3.6 Keyboard Test	139
3.7 Display Test	143
3.8 Floppy Disk Test	146
3.9 Printer Test	148
3.10 Hard Disk Test	150
3.11 Real Timer Test	154
3.12 NDP Test	157
3.13 Expansion Test	158
3.14 CD-ROM/DVD-ROM Test	160
3.15 LAN Test	161
3.16 Error Code and Error Status Names	162
3.17 Hard Disk Test Detail Status	165
3.18 Head Cleaning	167
3.19 Log Utilities	168
3.20 Running Test	170
3.21 Floppy Disk Drive Utilities	172
3.22 System Configuration	177
3.23 SETUP	179
3.24 Repair initial config set	196
3.25 Wireless LAN Test Program (Agere)	198
3.26 Wireless LAN Test Program (Atheros 11b/g or 11a/b/g)	202
3.27 Sound/LAN/Modem Test Program	205
3.28 IEEE1394 test program	210
3.29 Thermal Radiation Control Test	211
Chapter 4 Replacement Procedures	213
4.1 General	219
4.2 Battery pack	227
4.3 PC card	230
4.4 SD card	232
4.5 HDD	233
4.6 Heat sink/CPU	237
4.7 Optical drive	241
4.8 Keyboard	244
4.9 Memory module	247
4.10 Wireless LAN board/Modem Daughter Card	249
4.11 CD/DVD (Audio) play button	254
4.12 Display assembly	255
4.13 Touch pad	259
4.14 LED board	261
4.15 RTC battery	263
4.16 Sound board	265
4.17 System board/ Bat con cover	267
4.18 Fan	270
4.19 Modem cable	272
4.20 Wireless LAN cover	273
4.21 Battery lock assembly	274
4.22 Speaker	275
4.23 Display mask/LCD unit/FL inverter	278
4.24 LCD cable/Sensor switch/Wireless LAN antenna	283
4.25 Hinge	289
4.26 Fluorescent lamp	293
4.26.1 Replacing the 14.1 Inch XGA CHIMEI Fluorescent lamp	294
4.26.2 Replacing the 14.1 Inch XGA Samsung Fluorescent lamp	298
4.26.3 Replacing the 14.1 Inch XGA TMD Fluorescent lamp	304
4.26.4 Replacing the 15.0 Inch XGA CHIMEI Fluorescent lamp	316
4.26.5 Replacing the 15.0 Inch XGA LG.Philips Fluorescent lamp	322
4.26.6 Replacing the 15.0 Inch XGA Samsung Fluorescent lamp	332
4.26.7 Replacing the 15.0 Inch XGA Sharp Fluorescent lamp	340
4.26.8 Replacing the 15.0 Inch SXGA+ LG.Philips Fluorescent lamp	358
4.26.9 Replacing the 15.0 Inch SXGA+ Sharp Fluorescent lamp	367
Appendices	384
Appendix A Handling the LCD Module	393
Appendix B Board Layout	399
Appendix C Pin Assignment	405
Appendix D Keyboard Scan/Character Codes	427
Appendix E Key Layout	435
Appendix F Wiring Diagrams	439
Appendix G BIOS Rewrite Procedures	441
Appendix H EC/KBC Rewrite Procedures	443