HP Mini CQ10-100 Compaq Mini CQ10 Notebook PC - Maintenance and Service Guide - Page 66

and thermal tape is used on the Northbridge chip

Get HP Mini CQ10-100 - PC PDF manuals and user guides View all HP Mini CQ10-100 manuals
Add to My Manuals
Save this manual to your list of manuals

Page 66 highlights

2. Remove the heat sink assembly (2). NOTE: Due to the adhesive quality of the thermal material located between the heat sink assembly and system board components, it may be necessary to move the heat sink assembly from side to side to detach the assembly. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink assembly and the system board each time the heat sink assembly is removed. Thermal paste is used on the processor (1), and thermal tape is used on the Northbridge chip (2). Replacement thermal material is included with all heat sink assembly and system board spare part kits. Reverse this procedure to install the heat sink assembly. 58 Chapter 4 Removal and replacement procedures

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
  • 101
  • 102
  • 103
  • 104
  • 105
  • 106
  • 107
2.
Remove the heat sink assembly
(2)
.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink
assembly and system board components, it may be necessary to move the heat sink assembly from
side to side to detach the assembly.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink
assembly and the system board each time the heat sink assembly is removed. Thermal paste is
used on the processor
(1)
, and thermal tape is used on the Northbridge chip
(2)
. Replacement
thermal material is included with all heat sink assembly and system board spare part kits.
Reverse this procedure to install the heat sink assembly.
58
Chapter 4
Removal and replacement procedures