HP Pavilion g4-2000 HP Pavilion g4 Notebook PC - Maintenance and Service Guide - Page 77

services it only on computer models equipped with a graphics subsystem

Get HP Pavilion g4-2000 PDF manuals and user guides View all HP Pavilion g4-2000 manuals
Add to My Manuals
Save this manual to your list of manuals

Page 77 highlights

4. Remove the fan and heat sink (4). NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the base enclosure, heat sink, processor, and system board spare part kits. ● Thermal paste is used on the processor (1) and the heat sink section (2) that services it ● A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that services it (only on computer models equipped with a graphics subsystem with discrete memory) 1. If it is necessary to replace the fan, turn the fan and heat sink upside down with the fan toward you. 2. Remove the two Phillips M1.5 × 2.5 screws (1) that secure the fan to the heat sink. Component replacement procedures 69

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
  • 101
  • 102
  • 103
  • 104
4.
Remove the fan and heat sink
(4)
.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink
and the system board components each time the heat sink is removed. Replacement
thermal material is included with the base enclosure, heat sink, processor, and system board
spare part kits.
●
Thermal paste is used on the processor
(1)
and the heat sink section
(2)
that services it
●
A thermal pad is used on the graphics subsystem chip
(3)
and the heat sink section
(4)
that
services it (only on computer models equipped with a graphics subsystem with
discrete memory)
1.
If it is necessary to replace the fan, turn the fan and heat sink upside down with the fan
toward you.
2.
Remove the two Phillips M1.5 × 2.5 screws
(1)
that secure the fan to the heat sink.
Component replacement procedures
69