Intel SAI2 Product Specification - Page 14

PGA370 Socket, Processor Bus Termination / Regulation / Power, APIC Bus, Boxed Processors

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SAI2 Server Board Architecture Overview SAI2 Server Board TPS 2.1.3 PGA370 Socket The SAI2 server board provides two PGA370 sockets. These are 370-pin zero-insertion force (ZIF) sockets into which a FC-PGA package technology processor plugs. 2.1.4 Processor Bus Termination / Regulation / Power The termination circuitry required by the Intel Pentium III processor bus signaling environment, and the circuitry to set the AGTL/AGTL+ reference voltage, are implemented directly on the processor. The SAI2 server board provides VRM 8.5 compliant DC-to-DC converters to provide processor power, Voltage Controlled Current Plane (VCCP), at each PGA370 socket. The server board provides embedded VRMs for both the primary and secondary processors. Additional termination is provided on the SAI2 server board for terminator-less operation when only one processor is installed. 2.1.5 APIC Bus Interrupt notification and generation for the processors is done using an independent path between local APICs in each processor and the I/O APIC located in the CSB5 South Bridge component. 2.1.6 Boxed Processors The Intel Pentium III processor for the PGA370 socket is offered as an Intel boxed processor. Intel boxed processors are intended for system integrators who build systems from a server board and standard components. 2.1.6.1 Boxed Processor Fan Heatsinks The boxed Pentium III processor for the PGA370 socket will be supplied with an unattached fan heatsink that has an integrated clip. Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. Note that the airflow of the fan heatsink is into the center and out of the sides of the fan heatsink. The boxed processor thermal solution must be installed by a system integrator to secure the thermal cooling solution to the processor after it is installed in the 370-pin ZIF socket. The boxed processor's fan heatsink requires a +12-V power supply. A fan power cable is attached to the fan and connects to processor fan headers on the SAI2 server board. The boxed processor fan heatsink will keep the processor core at the recommended junction temperature, as long as airflow through the fan heatsink is unimpeded. It is recommended that the air temperature entering the fan inlet be below 45 °C (measured at 0.3 inches above the fan hub). 4 Revision 1.0

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SAI2 Server Board Architecture Overview
SAI2 Server Board TPS
Revision 1.0
4
2.1.3
PGA370 Socket
The SAI2 server board provides two PGA370 sockets. These are 370-pin zero-insertion force
(ZIF) sockets into which a FC-PGA package technology processor plugs.
2.1.4
Processor Bus Termination / Regulation / Power
The termination circuitry required by the Intel Pentium III processor bus signaling environment,
and the circuitry to set the AGTL/AGTL+ reference voltage, are implemented directly on the
processor. The SAI2 server board provides VRM 8.5 compliant DC-to-DC converters to provide
processor power, Voltage Controlled Current Plane (VCCP), at each PGA370 socket. The
server board provides embedded VRMs for both the primary and secondary processors.
Additional termination is provided on the SAI2 server board for terminator-less operation when
only one processor is installed.
2.1.5
APIC Bus
Interrupt notification and generation for the processors is done using an independent path
between local APICs in each processor and the I/O APIC located in the CSB5 South Bridge
component.
2.1.6
Boxed Processors
The Intel Pentium III processor for the PGA370 socket is offered as an Intel boxed processor.
Intel boxed processors are intended for system integrators who build systems from a server
board and standard components.
2.1.6.1
Boxed Processor Fan Heatsinks
The boxed Pentium III processor for the PGA370 socket will be supplied with an unattached fan
heatsink that has an integrated clip. Clearance is required around the fan heatsink to ensure
unimpeded airflow for proper cooling. Note that the airflow of the fan heatsink is into the center
and out of the sides of the fan heatsink. The boxed processor thermal solution must be installed
by a system integrator to secure the thermal cooling solution to the processor after it is installed
in the 370-pin ZIF socket.
The boxed processor’s fan heatsink requires a +12-V power supply. A fan power cable is
attached to the fan and connects to processor fan headers on the SAI2 server board.
The boxed processor fan heatsink will keep the processor core at the recommended junction
temperature, as long as airflow through the fan heatsink is unimpeded. It is recommended that
the air temperature entering the fan inlet be below 45
°
C (measured at 0.3 inches above the fan
hub).