HP ENVY 15-3033cl HP ENVY 15 - Maintenance and Service Guide - Page 85

that services it., Thermal paste is used on the graphics subsystem chip

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NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system board components each time the fan/heat sink assembly is removed. Replacement thermal material is included with the fan/heat sink assembly and system board spare part kits. The following illustration shows the replacement thermal material locations. ● Thermal paste is used on the processor (1) and the heat sink component (2) that services it ● Thermal paste is used on the graphics subsystem chip (3) and the heat sink component (4) that services it. ● Thermal pads are used on the four system board capacitors (5) and the heat sink components (6) that service them ENWW Component replacement procedures 77

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NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly and the system board components each time the fan/heat sink assembly is removed.
Replacement thermal material is included with the fan/heat sink assembly and system board
spare part kits. The following illustration shows the replacement thermal material locations.
●
Thermal paste is used on the processor
(1)
and the heat sink component
(2)
that services it
●
Thermal paste is used on the graphics subsystem chip
(3)
and the heat sink component
(4)
that services it.
●
Thermal pads are used on the four system board capacitors
(5)
and the heat sink
components
(6)
that service them
ENWW
Component replacement procedures
77