HP OMEN X 17-ap000 OMEN X by 17 Laptop PC Maintenance and Service Guide - Page 55

and the system board, the heat sink s

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NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Thermal paste is used on the processor (1 and 2), the graphics processor (3), the heat sink sections (2 and 4), and the system board (5 and 6). Component replacement procedures 43

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NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Thermal paste is used on the processor
(1 and 2)
, the
graphics processor
(3)
, the heat sink sections
(2 and 4)
, and the system board
(5 and 6)
.
Component replacement procedures
43