HP Pavilion dv7-6b00 HP Pavilion dv7 Notebook PC Maintenance and Service Guide - Page 95
A thermal pad is used on the Northbridge chip, that services
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4. Remove the fan/heat sink assembly (2). NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the fan/heat sink assembly is removed. Replacement thermal material is included with the fan/heat sink assembly, processor, and system board spare part kits. ● Thermal paste is used on the processor (1) and the heat sink section (2) that services it ● A thermal pad is used on the Northbridge chip (3) and the heat sink section (4) that services it ● A thermal pad is used on the graphics subsystem chip (5) and the heat sink section (6) that services it (only on computer models equipped with a graphics subsystem with discrete memory) Component replacement procedures 87
4.
Remove the fan/heat sink assembly
(2)
.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the fan/heat sink assembly is removed. Replacement
thermal material is included with the fan/heat sink assembly, processor, and system board spare
part kits.
●
Thermal paste is used on the processor
(1)
and the heat sink section
(2)
that services it
●
A thermal pad is used on the Northbridge chip
(3)
and the heat sink section
(4)
that
services it
●
A thermal pad is used on the graphics subsystem chip
(5)
and the heat sink section
(6)
that
services it (only on computer models equipped with a graphics subsystem with
discrete memory)
Component replacement procedures
87