HP Pavilion dv7-6b00 HP Pavilion dv7 Notebook PC Maintenance and Service Guide - Page 96

and the heat sink that services them

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NOTE: Steps 5 and 6 apply to computer models equipped with an Intel processor. See steps 3 and 4 for fan and heat sink removal information for computer models equipped with an AMD processor. 5. Following the 1 through 8 sequence indicated on the heat sink, loosen the eight screws (1) that secure the fan/heat sink assembly to the system board. NOTE: Due to the adhesive quality of the thermal material located between the heat sink and system board components, it may be necessary to move the fan/heat sink assembly from side to side to detach it. 6. Remove the fan/heat sink assembly (2). NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the fan/heat sink assembly is removed. Replacement thermal material is included with the fan/heat sink assembly, processor, and system board spare part kits. ● A thermal pad is used on the capacitors (1) and the heat sink section (2) that services them ● Thermal paste is used on the processor (3) and the heat sink section (4) that services it ● A thermal pad is used on the graphics subsystem chip (5) and the heat sink section (6) that services it (only on computer models equipped with a graphics subsystem with discrete memory) 88 Chapter 4 Removal and replacement procedures

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NOTE:
Steps 5 and 6 apply to computer models equipped with an Intel processor. See steps 3
and 4 for fan and heat sink removal information for computer models equipped with an
AMD processor.
5.
Following the 1 through 8 sequence indicated on the heat sink, loosen the eight screws
(1)
that
secure the fan/heat sink assembly to the system board.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink and
system board components, it may be necessary to move the fan/heat sink assembly from side to
side to detach it.
6.
Remove the fan/heat sink assembly
(2)
.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the fan/heat sink assembly is removed. Replacement
thermal material is included with the fan/heat sink assembly, processor, and system board spare
part kits.
●
A thermal pad is used on the capacitors
(1)
and the heat sink section
(2)
that services them
●
Thermal paste is used on the processor
(3)
and the heat sink section
(4)
that services it
●
A thermal pad is used on the graphics subsystem chip
(5)
and the heat sink section
(6)
that
services it (only on computer models equipped with a graphics subsystem with
discrete memory)
88
Chapter 4
Removal and replacement procedures