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Hitachi HTS541010G9AT00 Specifications - Page 48

Electromagnetic compatibility - driver

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6.12.4 Safe handling The product is conditioned for safe handling in regards to sharp edges and corners. 6.12.5 Environment The product does not contain any known or suspected carcinogens. Environmental controls meet or exceed all applicable government regulations in the country of origin. Safe chemical usage and manufacturing control are used to protect the environment. An environmental impact assessment has been done on the manufacturing process used to build the drive, the drive itself and the disposal of the drive at the end of its life. Production also meets the requirements of the international treaty on chlorofluorocarbon (CFC) control known as the United Nations Environment Program Montreal Protocol, and as ratified by the member nations. Material to be controlled include CFC-11, CFC-12, CFC-113, CFC-114, CFC-115, Halon 1211, Halon 1301 and Halon 2402. Although not specified by the Protocol, CFC-112 is also controlled. In addition to the Protocol Hitachi Global Storage Technologies requires the following: •that no packaging used for the shipment of the product use controlled CFCs in the manufacturing process. •that no manufacturing processes for parts or assemblies include printed circuit boards use controlled CFC materials. 6.12.6 Secondary circuit protection Spindle/VCM driver module includes 12 V over current protection circuit 6.13 Electromagnetic compatibility The drive, when installed in a suitable enclosure and exercised with a random accessing routine at maximum data rate meets the worldwide EMC requirements listed below: • United States Federal Communications Commission (FCC) Rules and Regulations (Class B), Part 15. (A 6 dB buffer shall be maintained on the emission requirements). •European Economic Community (EEC) directive number 76/889 related to the control of radio frequency interference and the Verband Deutscher Elektrotechniker (VDE) requirements of Germany (GOP). IBM National Bulletin NB 2-0001-400, NB 2-0001-401, and NB 2-0001-403. 6.13.1 CE mark The product is declared to be in conformity with requirements of the following EC directives under the sole responsibility of Hitachi Global Storage Technologies Japan Ltd: Council Directive 89/336/EEC on the approximation of laws of the Member States relating to electromagnetic compatibility. 6.13.2 C-TICK mark The product complies with the following Australian EMC standard: Limits and methods of measurement of radio disturbance characteristics of information technology, AS/NZS 3548 :1995 Class B. Travelstar 5K100 (Serial ATA) Hard Disk Drive Specification 36

Section	Page
1.0 General	13
1.1 Introduction	13
1.2 References	13
1.3 Abbreviations	13
1.4 Caution	15
2.0 General features of the drive	17
3.0 Fixed-disk subsystem description	21
3.1 Control electronics	21
3.2 Head disk assembly	21
4.0 Drive characteristics	23
4.1 Formatted capacity	23
4.2 Data sheet	24
4.3 Drive organization	25
4.3.1 Drive format	25
4.3.2 Cylinder allocation	26
4.4 Performance characteristics	28
4.4.1 Command overhead	28
4.4.2 Mechanical positioning	28
4.4.3 Drive ready time	30
4.4.4 Operating modes	30
5.0 Data integrity	33
5.1 Data loss at power off	33
5.2 Write Cache	33
5.3 Equipment status	33
5.4 WRITE safety	34
5.5 Data buffer test	34
5.6 Error recovery	34
5.7 Automatic reallocation	34
5.8 ECC	35
6.0 Specification	37
6.1 Environment	37
6.1.1 Temperature and humidity	37
6.1.2 Corrosion test	38
6.2 Radiation noise	38
6.3 Conductive noise	39
6.4 Magnetic fields	39
6.5 DC power requirements	39
6.5.1 Power consumption efficiency	40
6.6 Reliability	41
6.6.1 Data integrity	41
6.6.2 Cable noise interference	41
6.6.3 Service life and usage condition	41
6.6.4 Preventive maintenance	41
6.6.5 Load/Unload	41
6.7 Emergency unload	42
6.7.1 Required power-off sequence	42
6.8 Mechanical specifications	43
6.8.1 Physical dimensions and weight	43
6.8.2 Mounting hole locations	43
6.8.3 Connector and jumper description	44
6.8.4 Drive mounting	44
6.8.5 Load/unload mechanism	44
6.9 Vibration and shock	44
6.9.1 Operating vibration	44
6.9.2 Nonoperating vibration	45
6.9.3 Operating shock	45
6.9.4 Nonoperating shock	46
6.10 Acoustics	46
6.10.1 Discrete tone penalty	47
6.11 Identification labels	47
6.12 Safety	47
6.12.1 UL and CSA approval	47
6.12.2 German safety mark	47
6.12.3 Flammability	47
6.12.4 Safe handling	48
6.12.5 Environment	48
6.12.6 Secondary circuit protection	48
6.13 Electromagnetic compatibility	48
6.13.1 CE mark	48
6.13.2 C-TICK mark	48
6.13.3 BSMI mark	49
6.14 Packaging	49
7.0 Electrical interface specification	51
7.1 Cabling	51
7.2 Interface connector	51
7.3 Signal definitions	52
8.0 General	55
8.1 Introduction	55
8.2 Deviations from standard	55
9.0 Registers	57
9.1 Register naming convention	57
9.2 Command Register	57
9.3 Device Control Register	58
9.4 Device Register	58
9.5 Error Register	59
9.6 Features Regsiter	59
9.7 LBA High Register	59
9.8 LBA Low Register	60
9.9 LBA Mid Register	60
9.10 Sector Count Register	60
9.11 Status Register	60
10.0 General operation descriptions	63
10.1 Reset response	63
10.2 Register initialization	64
10.3 Diagnostic and Reset considerations	64
10.4 Power-off considerations	65
10.4.1 Emergency unload	65
10.4.2 Required power-off sequence	65
10.5 Sector Addressing Mode	65
10.5.1 Logical CHS Addressing Mode	66
10.5.2 LBA Addressing Mode	66
10.6 Power management features	66
10.6.1 Power mode	67
10.6.2 Power management commands	67
10.6.3 Standby/Sleep command completion time	67
10.6.4 Standby timer	67
10.6.5 Status	67
10.6.6 Interface capability for power modes	68
10.6.7 Initial Power Mode at Power On	68
10.7 Advanced Power Management (ABLE-3) feature	68
10.7.1 Performance Idle Mode	69
10.7.2 Active Idle Mode	69
10.7.3 Low Power Idle Mode	69
10.7.4 Transition time	69
10.8 S.M.A.R.T. Function	69
10.8.1 Attributes	70
10.8.2 Attribute values	70
10.8.3 Attribute thresholds	70
10.8.4 Threshold exceeded condition	70
10.8.5 S.M.A.R.T. commands	70
10.8.6 S.M.A.R.T. operation with power management modes	70
10.9 Security Mode Feature Set	70
10.9.1 Security mode	71
10.9.2 Security level	71
10.9.3 Password	71
10.9.4 Master Password Revision Code	71
10.9.5 Command table	75
10.10 Protected Area Function	76
10.10.1 Example for operation (In LBA Mode)	76
10.10.2 Set Max security extension commands	77
10.11 Seek Overlap	78
10.12 Write Cache function	79
10.13 Reassign Function	79
10.13.1 Auto Reassign Function	80
10.14 48-bit Address Feature Set	81
10.15 Software Setting Preservation Feature Set	81
10.15.1 Preserved software settings	82
11.0 Command protocol	83
11.1 Data In commands	83
11.2 Data Out Commands	84
11.3 Non-data commands	85
11.4 DMA data in commands	85
12.0 Command descriptions	87
12.1 Check Power Mode (E5h/98h)	91
12.2 Device Configuration Overlay (B1h)	92
12.2.1 DEVICE CONFIGURATION RESTORE (subcommand C0h)	92
12.2.2 DEVICE CONFIGURATION FREEZE LOCK (subcommand C1h)	92
12.2.3 DEVICE CONFIGURATION IDENTIFY (subcommand C2h)	93
12.2.4 DEVICE CONFIGURATION SET (subcommand C3h)	93
12.3 Execute Device Diagnostic (90h)	96
12.4 Flush Cache (E7h)	97
12.5 Flush Cache EXT (EAh)	98
12.6 Format Track (50h: vendor specific)	99
12.7 Format Unit (F7h: vendor specific)	100
12.8 Identify Device (ECh)	101
12.9 Idle (E3h/97h)	111
12.10 Idle Immediate (E1h/95h)	112
12.11 Initialize Device Parameters (91h)	113
12.12 Read Buffer (E4h)	114
12.13 Read DMA (C8h/C9h)	115
12.14 Read DMA EXT (25h)	117
12.15 Read Log Ext (2Fh)	119
12.15.1 General purpose log Directory	120
12.15.2 Extended comprehensive SMART error log	121
12.15.3 Error Log version	121
12.15.4 Extended Self-test log sector	123
12.16 Read Long (22h/23h)	125
12.17 Read Multiple (C4h)	127
12.18 Read Multiple EXT (29h)	129
12.19 Read Native Max ADDRESS (F8h)	130
12.20 Read Native Max ADDRESS EXT (27h)	131
12.21 Read Sectors (20h/21h)	132
12.22 Read Sector(s) EXT (24h)	133
12.23 Read Verify Sectors (40h/41h)	135
12.24 Ready Verify Sector(s) EXT (42h)	137
12.25 Recalibrate (1xh)	139
12.26 Security Disable Password (F6h)	140
12.27 Security Erase Unit (F3h)	141
12.28 Security Freeze Lock (F5h)	143
12.29 Security Set Password (F1h)	144
12.30 Security Unlock (F2h)	146
12.31 Seek (7xh)	147
12.32 Sense Condition (F0h: vendor specific)	148
12.33 Set Features (EFh)	149
12.34 Set Max ADDRESS (F9h)	151
12.35 Set Max ADDRESS EXT (37h)	153
12.36 Set Multiple (C6h)	155
12.37 Sleep (E6h/99h)	156
12.38 S.M.A.R.T. Function Set (B0h)	157
12.38.1 S.M.A.R.T. Function Subcommands	158
12.38.2 Device Attribute Data Structure	163
12.38.3 Device Attribute Thresholds data structure	168
12.38.4 S.M.A.R.T Log Directory	169
12.38.5 S.M.A.R.T. error log sector	170
12.38.6 Self-test log data structure	172
12.38.7 Selective self-test log data structure	172
12.38.8 Error reporting	174
12.39 Standby (E2h/96h)	175
12.40 Standby Immediate (E0h/94h)	176
12.41 Write Buffer (E8h)	177
12.42 Write DMA (CAh/CBh)	178
12.43 Write DMA EXT (35h)	180
12.44 Write Log Ext (3Fh)	182
12.45 Write Long (32h/33h)	183
12.46 Write Multiple (C5h)	185
12.47 Write Multiple EXT (39h)	186
12.48 Write Sectors (30h/31h)	188
12.49 Write Sectors(s) EXT (34h)	190
12.50 Write Verify (3Ch: vendor specific)	191
13.0 Timings	193
14.0 Appendix	195
14.1 Commands Support Coverage	195
14.2 SET FEATURES Commands Support Coverage	197

Match case Limit results 1 per page

Travelstar 5K100 (Serial ATA) Hard Disk Drive Specification

6.12.4

Safe handling

The product is conditioned for safe handling in regards to sharp edges and corners.

6.12.5

Environment

The product does not contain any known or suspected carcinogens.

Environmental controls meet or exceed all applicable government regulations in the country of origin. Safe chemi-

cal usage and manufacturing control are used to protect the environment. An environmental impact assessment has

been done on the manufacturing process used to build the drive, the drive itself and the disposal of the drive at the

end of its life.

Production also meets the requirements of the international treaty on chlorofluorocarbon (CFC) control known as

the United Nations Environment Program Montreal Protocol, and as ratified by the member nations. Material to be

controlled include CFC-11, CFC-12, CFC-113, CFC-114, CFC-115, Halon 1211, Halon 1301 and Halon 2402.

Although not specified by the Protocol, CFC-112 is also controlled. In addition to the Protocol Hitachi Global Stor-

age Technologies requires the following:

•that no packaging used for the shipment of the product use controlled CFCs in the manufacturing process.

•that no manufacturing processes for parts or assemblies include printed circuit boards use controlled CFC

materials.

6.12.6

Secondary circuit protection

Spindle/VCM driver module includes 12 V over current protection circuit

6.13

Electromagnetic compatibility

The drive, when installed in a suitable enclosure and exercised with a random accessing routine at maximum data

rate meets the worldwide EMC requirements listed below:

•

United States Federal Communications Commission (FCC) Rules and Regulations (Class B), Part 15.

(A 6 dB buffer shall be maintained on the emission requirements).

•European Economic Community (EEC) directive number 76/889 related to the control of radio frequency

interference and the Verband Deutscher Elektrotechniker (VDE) requirements of Germany (GOP). IBM

National Bulletin NB 2-0001-400, NB 2-0001-401, and NB 2-0001-403.

6.13.1

CE mark

The product is declared to be in conformity with requirements of the following EC directives under the sole

responsibility of Hitachi Global Storage Technologies Japan Ltd:

Council Directive 89/336/EEC on the approximation of laws of the Member States relating to electromagnetic

compatibility.

6.13.2

C-TICK mark

The product complies with the following Australian EMC standard:

Limits and methods of measurement of radio disturbance characteristics of information technology, AS/NZS 3548

:1995 Class B.