IBM HS40 Hardware Maintenance Manual - Page 44

Major, components, BladeCenter, blade, server

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v Do not leave the device where others can handle and possibly damage the device. v While the device is still in its static-protective package, touch it to an unpainted metal part of the BladeCenter unit or any unpainted metal surface on any other grounded rack component in the rack you are installing the device in for at least 2 seconds. This drains static electricity from the package and from your body. v Remove the device from its package and install it directly into your blade server without setting it down. If it is necessary to set the device down, place it in its static-protective package. Do not place the device on your blade server cover or on a metal table. v Take additional care when handling devices during cold weather. Heating reduces indoor humidity and increases static electricity. Major components of the BladeCenter HS40 Type 8839 blade server The following illustration shows the locations of major components in your blade server. You need to remove the blade server from the BladeCenter unit and remove the blade server cover to see the components. Note: The illustrations in this document might differ slightly from your hardware. Blade expansion connector terminator Air baffle Microprocessor heat-sink (up to 4) Microprocessor (up to 4) Microprocessor heat-sink filler (up to 3) Bezel Top cover I/O board DIMM (up to 8) Processor board 34 BladeCenter HS40 Type 8839: Hardware Maintenance Manual and Troubleshooting Guide

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v
Do
not
leave
the
device
where
others
can
handle
and
possibly
damage
the
device.
v
While
the
device
is
still
in
its
static-protective
package,
touch
it
to
an
unpainted
metal
part
of
the
BladeCenter
unit
or
any
unpainted
metal
surface
on
any
other
grounded
rack
component
in
the
rack
you
are
installing
the
device
in
for
at
least
2
seconds.
This
drains
static
electricity
from
the
package
and
from
your
body.
v
Remove
the
device
from
its
package
and
install
it
directly
into
your
blade
server
without
setting
it
down.
If
it
is
necessary
to
set
the
device
down,
place
it
in
its
static-protective
package.
Do
not
place
the
device
on
your
blade
server
cover
or
on
a
metal
table.
v
Take
additional
care
when
handling
devices
during
cold
weather.
Heating
reduces
indoor
humidity
and
increases
static
electricity.
Major
components
of
the
BladeCenter
HS40
Type
8839
blade
server
The
following
illustration
shows
the
locations
of
major
components
in
your
blade
server.
You
need
to
remove
the
blade
server
from
the
BladeCenter
unit
and
remove
the
blade
server
cover
to
see
the
components.
Note:
The
illustrations
in
this
document
might
differ
slightly
from
your
hardware.
Processor board
I/O board
Top cover
Microprocessor
heat-sink filler
(up to 3)
Microprocessor
heat-sink
(up to 4)
Microprocessor
(up to 4)
Bezel
DIMM
(up to 8)
Blade expansion
connector terminator
Air baffle
34
BladeCenter
HS40
Type
8839:
Hardware
Maintenance
Manual
and
Troubleshooting
Guide