Intel BX80571E5300 Data Sheet - Page 38
Package Insertion Specifications, Processor Mass Specification, Processor Materials, Processor
UPC - 735858204996
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Package Mechanical Specifications 3.5 Package Insertion Specifications The processor can be inserted into and removed from a LGA775 socket 15 times. The socket should meet the LGA775 requirements detailed in the LGA775 Socket Mechanical Design Guide. 3.6 Processor Mass Specification The typical mass of the processor is 21.5 g [0.76 oz]. This mass [weight] includes all the components that are included in the package. 3.7 Table 21. Processor Materials Table 21 lists some of the package components and associated materials. Processor Materials Component Integrated Heat Spreader (IHS) Substrate Substrate Lands Material Nickel Plated Copper Fiber Reinforced Resin Gold Plated Copper 3.8 Figure 9. Processor Markings Figure 9 shows the topside markings on the processor. This diagram is to aid in the identification of the processor. Processor Top-Side Markings Example INTEL ©M'06 E5200 Intel® Pentium® Dual-Core SLAY7 [COO] 2.50GHZ/2M/800/06 [FPO] e4 ATPO S/N 38 Datasheet