Intel E2180 Design Guide - Page 102
Solder Station Setup
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Figure 7-27. Solder Station Setup Case Temperature Reference Metrology 27. Remove the land side protective cover and place the device to be soldered in the solder station. Make sure the thermocouple wire for the device being soldered is exiting the heater toward you. Note: Do not touch the copper heater block at any time as this is very hot. 28. Move a magnified lens light close to the device in the solder status to get a better view when the solder begins to melt. 29. Lower the Heater block onto the IHS. Monitor the device IHS temperature during this step to ensure the maximum IHS temperature is not exceeded. Note: The target IHS temperature during reflow is 150 °C ±3 °C. At no time should the IHS temperature exceed 155 °C during the solder process as damage to the device may occur. 30. You may need to move the solder back toward the groove as the IHS begins to heat. Use a fine tip tweezers to push the solder into the end of the groove until a solder ball is built up (Figure 7-28 and Figure 7-29). 102 Thermal and Mechanical Design Guidelines