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Intel E2180 Design Guide - Page 70

Output Weighting Matrix, Proportional-Integral-Derivative PID

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Intel® Quiet System Technology (Intel® QST) Figure 7-1. Intel® QST Overview Intel® QST Temperature sensing and response Calculations (PID) Fan to sensor Relationship (Output Weighting Matrix) PECI / SST Fan Commands (PID) PWM Temperature Sensors Fans System Response 7.1.1 7.1.2 Output Weighting Matrix Intel QST provides an Output Weighting Matrix that provides a means for a single thermal sensor to affect the speed of multiple fans. An example of how the matrix could be used is if a sensor located next to the memory is sensitive to changes in both the processor heatsink fan and a 2nd fan in the system. By placing a factor in this matrix additional the Intel QST could command the processor thermal solution fan and this 2nd fan to both accelerate a small amount. At the system level these two small changes can result in a smaller change in acoustics than having a single fan respond to this sensor. Proportional-Integral-Derivative (PID) The use of Proportional-Integral-Derivative (PID) control algorithms allow the magnitude of fan response to be determined based upon the difference between current temperature readings and specific temperature targets. A major advantage of a PID Algorithm is the ability to control the fans to achieve sensor temperatures much closer to the TCONTROL. Figure 7-2 is an illustration of the PID fan control algorithm. As illustrated in the figure, when the actual temperature is below the target temperature, the fan will slow down. The current FSC devices have a fixed temperature vs. PWM output relationship and miss this opportunity to achieve additional acoustic benefits. As the actual temperature starts ramping up and approaches the target temperature, the algorithm will instruct the fan to speed up gradually, but will not abruptly increase the fan speed to respond to the condition. It can allow an overshoot over the target temperature for a short period of time while ramping up the fan to bring the actual temperature to the 70 Thermal and Mechanical Design Guidelines

Section	Page
1 Introduction	11
1.1 Document Goals and Scope	11
1.1.1 Importance of Thermal Management	11
1.1.2 Document Goals	11
1.1.3 Document Scope	12
1.2 References	13
1.3 Definition of Terms	13
2 Processor Thermal/Mechanical Information	15
2.1 Mechanical Requirements	15
2.1.1 Processor Package	15
2.1.2 Heatsink Attach	17
2.1.2.1 General Guidelines	17
2.1.2.2 Heatsink Clip Load Requirement	17
2.1.2.3 Additional Guidelines	18
2.2 Thermal Requirements	18
2.2.1 Processor Case Temperature	18
2.2.2 Thermal Profile	19
2.2.3 TCONTROL	20
2.3 Heatsink Design Considerations	21
2.3.1 Heatsink Size	22
2.3.2 Heatsink Mass	22
2.3.3 Package IHS Flatness	23
2.3.4 Thermal Interface Material	23
2.4 System Thermal Solution Considerations	24
2.4.1 Chassis Thermal Design Capabilities	24
2.4.2 Improving Chassis Thermal Performance	24
2.4.3 Summary	25
2.5 System Integration Considerations	25
3 Thermal Metrology	27
3.1 Characterizing Cooling Performance Requirements	27
3.1.1 Example	28
3.2 Processor Thermal Solution Performance Assessment	29
3.3 Local Ambient Temperature Measurement Guidelines	29
3.4 Processor Case Temperature Measurement Guidelines	32
4 Thermal Management Logic and Thermal Monitor Feature	33
4.1 Processor Power Dissipation	33
4.2 Thermal Monitor Implementation	33
4.2.1 PROCHOT# Signal	34
4.2.2 Thermal Control Circuit	34
4.2.2.1 Thermal Monitor	34
4.2.3 Thermal Monitor 2	35
4.2.4 Operation and Configuration	36
4.2.5 On-Demand Mode	37
4.2.6 System Considerations	37
4.2.7 Operating System and Application Software Considerations	38
4.2.8 THERMTRIP# Signal	38
4.2.9 Cooling System Failure Warning	38
4.2.10 Digital Thermal Sensor	38
4.2.11 Platform Environmental Control Interface (PECI)	39
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information	41
5.1 Overview of the Balanced Technology Extended (BTX) Reference Design	41
5.1.1 Target Heatsink Performance	41
5.1.2 Acoustics	42
5.1.3 Effective Fan Curve	44
5.1.4 Voltage Regulator Thermal Management	45
5.1.5 Altitude	46
5.1.6 Reference Heatsink Thermal Validation	46
5.2 Environmental Reliability Testing	46
5.2.1 Structural Reliability Testing	46
5.2.1.1 Random Vibration Test Procedure	47
5.2.1.2 Shock Test Procedure	47
5.2.2 Power Cycling	49
5.2.3 Recommended BIOS/CPU/Memory Test Procedures	49
5.3 Material and Recycling Requirements	49
5.4 Safety Requirements	50
5.5 Geometric Envelope for Intel Reference BTX Thermal Module Assembly	50
5.6 Preload and TMA Stiffness	51
5.6.1 Structural Design Strategy	51
5.6.2 TMA Preload versus Stiffness	51
6 ATX Thermal/Mechanical Design Information	55
6.1 ATX Reference Design Requirements	55
6.2 Validation Results for Reference Design	58
6.2.1 Heatsink Performance	58
6.2.2 Acoustics	59
6.2.3 Altitude	60
6.2.4 Heatsink Thermal Validation	60
6.3 Environmental Reliability Testing	61
6.3.1 Structural Reliability Testing	61
6.3.1.1 Random Vibration Test Procedure	61
6.3.1.2 Shock Test Procedure	61
6.3.2 Power Cycling	63
6.3.3 Recommended BIOS/CPU/Memory Test Procedures	63
6.4 Material and Recycling Requirements	63
6.5 Safety Requirements	64
6.6 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design	64
6.7 Reference Attach Mechanism	65
6.7.1 Structural Design Strategy	65
6.7.2 Mechanical Interface to the Reference Attach Mechanism	66
7 Intel® Quiet System Technology (Intel® QST)	69
7.1 Intel® QST Algorithm	69
7.1.1 Output Weighting Matrix	70
7.1.2 Proportional-Integral-Derivative (PID)	70
7.2 Board and System Implementation of Intel® QST	72
7.3 Intel® QST Configuration and Tuning	74

Match case Limit results 1 per page

Intel® Quiet System Technology (Intel® QST)

Thermal and Mechanical Design Guidelines

Figure

7-1. Intel

QST Overview

Fan to sensor

Relationship

(Output Weighting Matrix)

Temperature sensing

and response

Calculations

(PID)

Fan Commands

(PID)

Fans

Temperature

Sensors

Intel

QST

System Response

PWM

PECI / SST

7.1.1

Output Weighting Matrix

Intel QST provides an Output Weighting Matrix that provides a means for a single

thermal sensor to affect the speed of multiple fans. An example of how the matrix

could be used is if a sensor located next to the memory is sensitive to changes in both

the processor heatsink fan and a 2

fan in the system. By placing a factor in this

matrix additional the Intel QST could command the processor thermal solution fan and

this 2

fan to both accelerate a small amount. At the system level these two small

changes can result in a smaller change in acoustics than having a single fan respond

to this sensor.

7.1.2

Proportional-Integral-Derivative (PID)

The use of Proportional-Integral-Derivative (PID) control algorithms allow the

magnitude of fan response to be determined based upon the difference between

current temperature readings and specific temperature targets. A major advantage of

a PID Algorithm is the ability to control the fans to achieve sensor temperatures much

closer to the T

CONTROL

Figure

7-2 is an illustration of the PID fan control algorithm. As illustrated in the

figure, when the actual temperature is below the target temperature, the fan will slow

down. The current FSC devices have a fixed temperature vs. PWM output relationship

and miss this opportunity to achieve additional acoustic benefits. As the actual

temperature starts ramping up and approaches the target temperature, the algorithm

will instruct the fan to speed up gradually, but will not abruptly increase the fan speed

to respond to the condition. It can allow an overshoot over the target temperature for

a short period of time while ramping up the fan to bring the actual temperature to the