Intel E2180 Design Guide - Page 104
Removing Excess Solder
UPC - 683728169121
View all Intel E2180 manuals
Add to My Manuals
Save this manual to your list of manuals |
Page 104 highlights
Case Temperature Reference Metrology 31. Lift the heater block and magnified lens, using tweezers quickly rotate the device 90 degrees clockwise. Using the back of the tweezers press down on the solder this will force out the excess solder Figure 7-30. Removing Excess Solder 32. Allow the device to cool down. Blowing compressed air on the device can accelerate the cooling time. Monitor the device IHS temperature with a handheld meter until it drops below 50 °C before moving it to the microscope for the final steps 104 Thermal and Mechanical Design Guidelines
Case Temperature Reference Metrology
104
Thermal and Mechanical Design Guidelines
31.
Lift the heater block and magnified lens, using tweezers quickly rotate the device
90 degrees clockwise. Using the back of the tweezers press down on the solder
this will force out the excess solder
Figure
7-30. Removing Excess Solder
32.
Allow the device to cool down. Blowing compressed air on the device can
accelerate the cooling time. Monitor the device IHS temperature with a handheld
meter until it drops below 50 °C before moving it to the microscope for the final
steps