Intel E2180 Design Guide - Page 107
Removing Excess Adhesive from IHS, 36. Finished Thermocouple Installation
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Case Temperature Reference Metrology Figure 7-35. Removing Excess Adhesive from IHS 39. Using a blade, carefully shave any adhesive that is above the IHS surface (see Figure 7-35). The preferred method is to shave from the edge to the center of the IHS. Note: The adhesive shaving step should be performed while the adhesive is partially cured, but still soft. This will help to keep the adhesive surface flat and smooth with no pits or voids. If there are voids in the adhesive, refill the voids with adhesive and shave a second time. 40. Clean IHS surface with IPA and a wipe. 41. Clean the LGA pads with IPA and a wipe. 42. Replace the land side cover on the device. 43. Perform a final continuity test. 44. Wind the thermocouple wire into loops and secure or if provided by the vendor back onto the plastic roll (see Figure 7-36). Figure 7-36. Finished Thermocouple Installation Thermal and Mechanical Design Guidelines 107