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Intel E2180 Design Guide - Page 20

Example Thermal Profile

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Processor Thermal/Mechanical Information Section 3.1). The intercept on the thermal profile assumes a maximum ambient operating condition that is consistent with the available chassis solutions. To determine compliance to the thermal profile, a measurement of the actual processor power dissipation is required. The measured power is plotted on the Thermal Profile to determine the maximum case temperature. Using the example in Figure 2-3 for the Intel® Core™2 Duo processor with 4 MB cache at Tc-max of 60.1 °C dissipating 50 W, the maximum case temperature is 56.2 °C. See the datasheet for the thermal profile. Figure 2-3. Example Thermal Profile 2.2.3 TCONTROL TCONTROL defines the maximum operating temperature for the digital thermal sensor when the thermal solution fan speed is being controlled by the digital thermal sensor. The TCONTROL parameter defines a very specific processor operating region where fan speed can be reduced. This allows the system integrator a method to reduce the acoustic noise of the processor cooling solution, while maintaining compliance to the processor thermal specification. Note: The TCONTROL value for the processor is relative to the Thermal Control Circuit (TCC) activation set point which will be seen as 0 via the digital thermal sensor. As a result the TCONTROL value will always be a negative number. See Chapter 4 for the discussion the thermal management logic and features and Chapter 7 on Intel® Quiet System Technology (Intel® QST). The value of TCONTROL is driven by a number of factors. One of the most significant of these is the processor idle power. As a result a processor with a high (closer to 0 ) 20 Thermal and Mechanical Design Guidelines

Section	Page
1 Introduction	11
1.1 Document Goals and Scope	11
1.1.1 Importance of Thermal Management	11
1.1.2 Document Goals	11
1.1.3 Document Scope	12
1.2 References	13
1.3 Definition of Terms	13
2 Processor Thermal/Mechanical Information	15
2.1 Mechanical Requirements	15
2.1.1 Processor Package	15
2.1.2 Heatsink Attach	17
2.1.2.1 General Guidelines	17
2.1.2.2 Heatsink Clip Load Requirement	17
2.1.2.3 Additional Guidelines	18
2.2 Thermal Requirements	18
2.2.1 Processor Case Temperature	18
2.2.2 Thermal Profile	19
2.2.3 TCONTROL	20
2.3 Heatsink Design Considerations	21
2.3.1 Heatsink Size	22
2.3.2 Heatsink Mass	22
2.3.3 Package IHS Flatness	23
2.3.4 Thermal Interface Material	23
2.4 System Thermal Solution Considerations	24
2.4.1 Chassis Thermal Design Capabilities	24
2.4.2 Improving Chassis Thermal Performance	24
2.4.3 Summary	25
2.5 System Integration Considerations	25
3 Thermal Metrology	27
3.1 Characterizing Cooling Performance Requirements	27
3.1.1 Example	28
3.2 Processor Thermal Solution Performance Assessment	29
3.3 Local Ambient Temperature Measurement Guidelines	29
3.4 Processor Case Temperature Measurement Guidelines	32
4 Thermal Management Logic and Thermal Monitor Feature	33
4.1 Processor Power Dissipation	33
4.2 Thermal Monitor Implementation	33
4.2.1 PROCHOT# Signal	34
4.2.2 Thermal Control Circuit	34
4.2.2.1 Thermal Monitor	34
4.2.3 Thermal Monitor 2	35
4.2.4 Operation and Configuration	36
4.2.5 On-Demand Mode	37
4.2.6 System Considerations	37
4.2.7 Operating System and Application Software Considerations	38
4.2.8 THERMTRIP# Signal	38
4.2.9 Cooling System Failure Warning	38
4.2.10 Digital Thermal Sensor	38
4.2.11 Platform Environmental Control Interface (PECI)	39
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information	41
5.1 Overview of the Balanced Technology Extended (BTX) Reference Design	41
5.1.1 Target Heatsink Performance	41
5.1.2 Acoustics	42
5.1.3 Effective Fan Curve	44
5.1.4 Voltage Regulator Thermal Management	45
5.1.5 Altitude	46
5.1.6 Reference Heatsink Thermal Validation	46
5.2 Environmental Reliability Testing	46
5.2.1 Structural Reliability Testing	46
5.2.1.1 Random Vibration Test Procedure	47
5.2.1.2 Shock Test Procedure	47
5.2.2 Power Cycling	49
5.2.3 Recommended BIOS/CPU/Memory Test Procedures	49
5.3 Material and Recycling Requirements	49
5.4 Safety Requirements	50
5.5 Geometric Envelope for Intel Reference BTX Thermal Module Assembly	50
5.6 Preload and TMA Stiffness	51
5.6.1 Structural Design Strategy	51
5.6.2 TMA Preload versus Stiffness	51
6 ATX Thermal/Mechanical Design Information	55
6.1 ATX Reference Design Requirements	55
6.2 Validation Results for Reference Design	58
6.2.1 Heatsink Performance	58
6.2.2 Acoustics	59
6.2.3 Altitude	60
6.2.4 Heatsink Thermal Validation	60
6.3 Environmental Reliability Testing	61
6.3.1 Structural Reliability Testing	61
6.3.1.1 Random Vibration Test Procedure	61
6.3.1.2 Shock Test Procedure	61
6.3.2 Power Cycling	63
6.3.3 Recommended BIOS/CPU/Memory Test Procedures	63
6.4 Material and Recycling Requirements	63
6.5 Safety Requirements	64
6.6 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design	64
6.7 Reference Attach Mechanism	65
6.7.1 Structural Design Strategy	65
6.7.2 Mechanical Interface to the Reference Attach Mechanism	66
7 Intel® Quiet System Technology (Intel® QST)	69
7.1 Intel® QST Algorithm	69
7.1.1 Output Weighting Matrix	70
7.1.2 Proportional-Integral-Derivative (PID)	70
7.2 Board and System Implementation of Intel® QST	72
7.3 Intel® QST Configuration and Tuning	74