Intel E2180 Design Guide - Page 97
Thermocouple Bead Placement
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Case Temperature Reference Metrology Figure 7-19. Thermocouple Bead Placement (A) (B) 16. Place the package under the microscope to continue with process. It is also recommended to use a fixture (like processor tray or a plate) to help holding the unit in place for the rest of the attach process. 17. While still at the microscope, press the wire down about 6mm [0.125"] from the thermocouple bead using the tweezers or your finger. Place a piece of Kapton* tape to hold the wire inside the groove (Figure 7-20). Refer to Figure 7-21 for detailed bead placement. Thermal and Mechanical Design Guidelines 97
Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines
97
Figure
7-19. Thermocouple Bead Placement
(A)
(B)
16.
Place the package under the microscope to continue with process. It is also
recommended to use a fixture (like processor tray or a plate) to help holding the
unit in place for the rest of the attach process.
17.
While still at the microscope, press the wire down about 6mm [0.125”] from the
thermocouple bead using the tweezers or your finger. Place a piece of Kapton*
tape to hold the wire inside the groove (Figure
7-20). Refer to Figure
7-21 for
detailed bead placement.