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Intel E2180 Design Guide - Page 46

Environmental Reliability Testing

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Balanced Technology Extended (BTX) Thermal/Mechanical Design Information Table 5-3. VR Airflow Requirements Item Target Minimum VR bypass airflow for 775_VR_CONFIG_06 processors 2.4 CFM NOTES: 1. This is the recommended airflow rate that should be delivered to the VR when the VR power is at a maximum in order to support the 775_VR_CONFIG_06 processors at TDP power dissipation and the chassis external environment temperature is at 35 ºC. Less airflow is necessary when the VR power is not at a maximum or if the external ambient temperature is less than 35 ºC. 2. This recommended airflow rate is based on the requirements for the Intel® 965 Express Chipset Family. 5.1.5 Altitude The reference TMA will be evaluated at sea level. However, many companies design products that must function reliably at high altitude, typically 1,500 m [5,000 ft] or more. Air-cooled temperature calculations and measurements at sea level must be adjusted to take into account altitude effects like variation in air density and overall heat capacity. This often leads to some degradation in thermal solution performance compared to what is obtained at sea level, with lower fan performance and higher surface temperatures. The system designer needs to account for altitude effects in the overall system thermal design to make sure that the T requirement for the processor C is met at the targeted altitude. 5.1.6 Reference Heatsink Thermal Validation The Intel reference heatsink will be validated within the specific boundary conditions based on the methodology described Section 5.2. Testing is done in a BTX chassis at ambient lab temperature. The test results, for a number of samples, will be reported in terms of a worst-case mean + 3σ value for thermal characterization parameter using real processors (based on the thermal test vehicle correction factors). 5.2 Environmental Reliability Testing 5.2.1 Structural Reliability Testing Structural reliability tests consist of unpackaged, system -level vibration and shock tests of a given thermal solution in the assembled state. The thermal solution should meet the specified thermal performance targets after these tests are conducted; however, the test conditions outlined here may differ from your own system requirements. 46 Thermal and Mechanical Design Guidelines

Section	Page
1 Introduction	11
1.1 Document Goals and Scope	11
1.1.1 Importance of Thermal Management	11
1.1.2 Document Goals	11
1.1.3 Document Scope	12
1.2 References	13
1.3 Definition of Terms	13
2 Processor Thermal/Mechanical Information	15
2.1 Mechanical Requirements	15
2.1.1 Processor Package	15
2.1.2 Heatsink Attach	17
2.1.2.1 General Guidelines	17
2.1.2.2 Heatsink Clip Load Requirement	17
2.1.2.3 Additional Guidelines	18
2.2 Thermal Requirements	18
2.2.1 Processor Case Temperature	18
2.2.2 Thermal Profile	19
2.2.3 TCONTROL	20
2.3 Heatsink Design Considerations	21
2.3.1 Heatsink Size	22
2.3.2 Heatsink Mass	22
2.3.3 Package IHS Flatness	23
2.3.4 Thermal Interface Material	23
2.4 System Thermal Solution Considerations	24
2.4.1 Chassis Thermal Design Capabilities	24
2.4.2 Improving Chassis Thermal Performance	24
2.4.3 Summary	25
2.5 System Integration Considerations	25
3 Thermal Metrology	27
3.1 Characterizing Cooling Performance Requirements	27
3.1.1 Example	28
3.2 Processor Thermal Solution Performance Assessment	29
3.3 Local Ambient Temperature Measurement Guidelines	29
3.4 Processor Case Temperature Measurement Guidelines	32
4 Thermal Management Logic and Thermal Monitor Feature	33
4.1 Processor Power Dissipation	33
4.2 Thermal Monitor Implementation	33
4.2.1 PROCHOT# Signal	34
4.2.2 Thermal Control Circuit	34
4.2.2.1 Thermal Monitor	34
4.2.3 Thermal Monitor 2	35
4.2.4 Operation and Configuration	36
4.2.5 On-Demand Mode	37
4.2.6 System Considerations	37
4.2.7 Operating System and Application Software Considerations	38
4.2.8 THERMTRIP# Signal	38
4.2.9 Cooling System Failure Warning	38
4.2.10 Digital Thermal Sensor	38
4.2.11 Platform Environmental Control Interface (PECI)	39
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information	41
5.1 Overview of the Balanced Technology Extended (BTX) Reference Design	41
5.1.1 Target Heatsink Performance	41
5.1.2 Acoustics	42
5.1.3 Effective Fan Curve	44
5.1.4 Voltage Regulator Thermal Management	45
5.1.5 Altitude	46
5.1.6 Reference Heatsink Thermal Validation	46
5.2 Environmental Reliability Testing	46
5.2.1 Structural Reliability Testing	46
5.2.1.1 Random Vibration Test Procedure	47
5.2.1.2 Shock Test Procedure	47
5.2.2 Power Cycling	49
5.2.3 Recommended BIOS/CPU/Memory Test Procedures	49
5.3 Material and Recycling Requirements	49
5.4 Safety Requirements	50
5.5 Geometric Envelope for Intel Reference BTX Thermal Module Assembly	50
5.6 Preload and TMA Stiffness	51
5.6.1 Structural Design Strategy	51
5.6.2 TMA Preload versus Stiffness	51
6 ATX Thermal/Mechanical Design Information	55
6.1 ATX Reference Design Requirements	55
6.2 Validation Results for Reference Design	58
6.2.1 Heatsink Performance	58
6.2.2 Acoustics	59
6.2.3 Altitude	60
6.2.4 Heatsink Thermal Validation	60
6.3 Environmental Reliability Testing	61
6.3.1 Structural Reliability Testing	61
6.3.1.1 Random Vibration Test Procedure	61
6.3.1.2 Shock Test Procedure	61
6.3.2 Power Cycling	63
6.3.3 Recommended BIOS/CPU/Memory Test Procedures	63
6.4 Material and Recycling Requirements	63
6.5 Safety Requirements	64
6.6 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design	64
6.7 Reference Attach Mechanism	65
6.7.1 Structural Design Strategy	65
6.7.2 Mechanical Interface to the Reference Attach Mechanism	66
7 Intel® Quiet System Technology (Intel® QST)	69
7.1 Intel® QST Algorithm	69
7.1.1 Output Weighting Matrix	70
7.1.2 Proportional-Integral-Derivative (PID)	70
7.2 Board and System Implementation of Intel® QST	72
7.3 Intel® QST Configuration and Tuning	74

Match case Limit results 1 per page

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information

Thermal and Mechanical Design Guidelines

Table

5-3. VR Airflow Requirements

Item

Target

Minimum VR bypass airflow for

775_VR_CONFIG_06 processors

2.4 CFM

NOTES:

This is the recommended airflow rate that should be delivered to the VR when the VR

power is at a maximum in order to support the

775_VR_CONFIG_06 processors at TDP

power dissipation and the chassis external environment temperature is at 35 ºC. Less

airflow is necessary when the VR power is not at a maximum or if the external ambient

temperature is less than 35 ºC.

This recommended airflow rate is based on the requirements for the Intel

965 Express

Chipset Family.

5.1.5

Altitude

The reference TMA will be evaluated at sea level. However, many companies design

products that must function reliably at high altitude, typically 1,500 m [5,000 ft] or

more. Air-cooled temperature calculations and measurements at sea level must be

adjusted to take into account altitude effects like variation in air density and overall

heat capacity. This often leads to some degradation in thermal solution performance

compared to what is obtained at sea level, with lower fan performance and higher

surface temperatures. The system designer needs to account for altitude effects in the

overall system thermal design to make sure that the T

requirement for the processor

is met at the targeted altitude.

5.1.6

Reference Heatsink Thermal Validation

The Intel reference heatsink will be validated within the specific boundary conditions

based on the methodology described Section

5.2.

Testing is done in a BTX chassis at ambient lab temperature. The test results, for a

number of samples, will be reported in terms of a worst-case mean + 3

value for

thermal characterization parameter using real processors (based on the thermal test

vehicle correction factors).

5.2

Environmental Reliability Testing

5.2.1

Structural Reliability Testing

Structural reliability tests consist of unpackaged, system -level vibration and shock

tests of a given thermal solution in the assembled state. The thermal solution should

meet the specified thermal performance targets after these tests are conducted;

however, the test conditions outlined here may differ from your own system

requirements.