Intel E2180 Design Guide - Page 4

Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant - cpu

Get Intel E2180 - Pentium Dual-Core 2.00GHz 800MHz 1MB Socket 775 CPU PDF manuals and user guides
UPC - 683728169121
View all Intel E2180 manuals
Add to My Manuals
Save this manual to your list of manuals

Page 4 highlights

4.2.10 Digital Thermal Sensor 38 4.2.11 Platform Environmental Control Interface (PECI 39 5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information ........41 5.1 Overview of the Balanced Technology Extended (BTX) Reference Design ......41 5.1.1 Target Heatsink Performance 41 5.1.2 Acoustics 42 5.1.3 Effective Fan Curve 44 5.1.4 Voltage Regulator Thermal Management 45 5.1.5 Altitude 46 5.1.6 Reference Heatsink Thermal Validation 46 5.2 Environmental Reliability Testing 46 5.2.1 Structural Reliability Testing 46 5.2.2 Power Cycling 49 5.2.3 Recommended BIOS/CPU/Memory Test Procedures 49 5.3 Material and Recycling Requirements 49 5.4 Safety Requirements 50 5.5 Geometric Envelope for Intel Reference BTX Thermal Module Assembly ........50 5.6 Preload and TMA Stiffness 51 5.6.1 5.6.2 Structural Design Strategy 51 TMA Preload versus Stiffness 51 6 ATX Thermal/Mechanical Design Information 55 6.1 ATX Reference Design Requirements 55 6.2 Validation Results for Reference Design 58 6.2.1 6.2.2 6.2.3 6.2.4 Heatsink Performance 58 Acoustics 59 Altitude 60 Heatsink Thermal Validation 60 6.3 Environmental Reliability Testing 61 6.3.1 6.3.2 6.3.3 Structural Reliability Testing 61 Power Cycling 63 Recommended BIOS/CPU/Memory Test Procedures 63 6.4 Material and Recycling Requirements 63 6.5 Safety Requirements 64 6.6 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design ......64 6.7 Reference Attach Mechanism 65 6.7.1 6.7.2 Structural Design Strategy 65 Mechanical Interface to the Reference Attach Mechanism 66 7 Intel® Quiet System Technology (Intel® QST 69 7.1 Intel® QST Algorithm 69 7.1.1 Output Weighting Matrix 70 7.1.2 Proportional-Integral-Derivative (PID 70 7.2 Board and System Implementation of Intel® QST 72 7.3 Intel® QST Configuration and Tuning 74 7.4 Fan Hub Thermistor and Intel® QST 74 Appendix A LGA775 Socket Heatsink Loading 75 A.1 LGA775 Socket Heatsink Considerations 75 A.2 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel® Reference Design 75 4 Thermal and Mechanical Design Guidelines

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
  • 101
  • 102
  • 103
  • 104
  • 105
  • 106
  • 107
  • 108
  • 109
  • 110
  • 111
  • 112
  • 113
  • 114
  • 115
  • 116
  • 117
  • 118
  • 119
  • 120
  • 121
  • 122
  • 123
  • 124
  • 125
  • 126
  • 127
  • 128
  • 129
  • 130
  • 131
  • 132
  • 133
  • 134
  • 135
  • 136
  • 137
  • 138
  • 139
  • 140
  • 141
  • 142
  • 143
  • 144
  • 145
  • 146
  • 147
  • 148
4
Thermal and Mechanical Design Guidelines
4.2.10
Digital Thermal Sensor
.............................................................
38
4.2.11
Platform Environmental Control Interface (PECI)
..........................
39
5
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information
........
41
5.1
Overview of the Balanced Technology Extended (BTX) Reference Design
......
41
5.1.1
Target Heatsink Performance
....................................................
41
5.1.2
Acoustics
...............................................................................
42
5.1.3
Effective Fan Curve
.................................................................
44
5.1.4
Voltage Regulator Thermal Management
.....................................
45
5.1.5
Altitude
..................................................................................
46
5.1.6
Reference Heatsink Thermal Validation
.......................................
46
5.2
Environmental Reliability Testing
............................................................
46
5.2.1
Structural Reliability Testing
.....................................................
46
5.2.2
Power Cycling
.........................................................................
49
5.2.3
Recommended BIOS/CPU/Memory Test Procedures
......................
49
5.3
Material and Recycling Requirements
......................................................
49
5.4
Safety Requirements
............................................................................
50
5.5
Geometric Envelope for Intel Reference BTX Thermal Module Assembly
........
50
5.6
Preload and TMA Stiffness
.....................................................................
51
5.6.1
Structural Design Strategy
........................................................
51
5.6.2
TMA Preload versus Stiffness
....................................................
51
6
ATX Thermal/Mechanical Design Information
.......................................................
55
6.1
ATX Reference Design Requirements
.......................................................
55
6.2
Validation Results for Reference Design
...................................................
58
6.2.1
Heatsink Performance
..............................................................
58
6.2.2
Acoustics
...............................................................................
59
6.2.3
Altitude
..................................................................................
60
6.2.4
Heatsink Thermal Validation
.....................................................
60
6.3
Environmental Reliability Testing
............................................................
61
6.3.1
Structural Reliability Testing
.....................................................
61
6.3.2
Power Cycling
.........................................................................
63
6.3.3
Recommended BIOS/CPU/Memory Test Procedures
......................
63
6.4
Material and Recycling Requirements
......................................................
63
6.5
Safety Requirements
............................................................................
64
6.6
Geometric Envelope for Intel Reference ATX Thermal Mechanical Design
......
64
6.7
Reference Attach Mechanism
..................................................................
65
6.7.1
Structural Design Strategy
........................................................
65
6.7.2
Mechanical Interface to the Reference Attach Mechanism
..............
66
7
Intel
®
Quiet System Technology (Intel
®
QST)
.....................................................
69
7.1
Intel
®
QST Algorithm
............................................................................
69
7.1.1
Output Weighting Matrix
..........................................................
70
7.1.2
Proportional-Integral-Derivative (PID)
........................................
70
7.2
Board and System Implementation of Intel
®
QST
......................................
72
7.3
Intel
®
QST Configuration and Tuning
.......................................................
74
7.4
Fan Hub Thermistor and Intel
®
QST
........................................................
74
Appendix A
LGA775 Socket Heatsink Loading
......................................................................
75
A.1
LGA775 Socket Heatsink Considerations
..................................................
75
A.2
Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant
with Intel
®
Reference Design
.................................................................
75