HP Engage Flex Pro-C G2 Maintenance and Service Guide - Page 13
Computer major components and their descriptions, continued, Table 2-1
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Table 2-1 Computer major components and their descriptions (continued) Item Description 8 GB (6) Heat sink (7) Processor Intel® Core® i9-13900TE processor Intel Core i7-13700TE processor Intel Core i5-13500TE processor Intel Core i5-13500E processor Intel Core i3-13100TE processor Intel Core i3-13100E processor Intel Pentium® Gold G7400E processor Intel Celeron® G6900TE processor Intel Celeron G6900E processor (8) System board NOTE: System boards are available for computers with a non-Windows® operating system, Windows IoT, and Windows. (9) WLAN module Intel Wi-Fi® 5 AX211 + Bluetooth® 5.2 (vPro) Intel Wi-Fi 5 AX211 + Bluetooth 5.2 (non-vPro) Realtek 8852CE Wi-Fi 6E Bluetooth 5.3 WLAN (10) Solid-state drive with heat sink (M.2 2280, PCIe-4×4) 2 TB, TLC 1 TB, TLC 1 TB 512 GB, TLC 512 GB 512 GB, self-encrypting drive (SED) 256 GB 256 GB, self-encrypting drive (SED) (11) Rear expansion port (12) Computer chassis (13) Rear flex card Dual USB Type-A ports USB Type-C with DisplayPort (15 W output) USB Type-C with DisplayPort (27 W an d65 W output) Computer major components 7