HP Mini 100e HP Mini 100e Education Edition - Maintenance and Service Guide - Page 63

Fan and heat sink assembly see, Remove the system board

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f. Hard drive (see Hard drive assembly on page 36) g. Keyboard (see Keyboard on page 38) h. Top cover (see Top cover on page 41) i. Display assembly (see Display assembly on page 47) j. Speaker (see Speaker on page 45) k. Handle (see Handle (select models only) on page 53) When replacing the system board, be sure that the following components are removed from the defective system board and installed on the replacement system board: ● WLAN module (see WLAN module on page 35) ● Memory module (see Memory module on page 32) ● RTC battery (see RTC battery on page 34) ● Fan and heat sink assembly (see Fan and heat sink assembly on page 59) Remove the system board: 1. Disconnect the power connector from the system board on the bottom of the computer. 2. Remove the 4 Phillips 2.0x6.0 screws (1) that secure the system board to the base enclosure. 3. Place your fingers underneath the system board in the empty memory module slot (2) and gently apply pressure to slightly flex the system board while lifting the left edge (3). Component replacement procedures 55

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f.
Hard drive (see
Hard drive assembly
on page
36
)
g.
Keyboard (see
Keyboard
on page
38
)
h.
Top cover (see
Top cover
on page
41
)
i.
Display assembly (see
Display assembly
on page
47
)
j.
Speaker (see
Speaker
on page
45
)
k.
Handle (see
Handle (select models only)
on page
53
)
When replacing the system board, be sure that the following components are removed from the
defective system board and installed on the replacement system board:
●
WLAN module (see
WLAN module
on page
35
)
●
Memory module (see
Memory module
on page
32
)
●
RTC battery (see
RTC battery
on page
34
)
●
Fan and heat sink assembly (see
Fan and heat sink assembly
on page
59
)
Remove the system board:
1.
Disconnect the power connector from the system board on the bottom of the computer.
2.
Remove the 4 Phillips 2.0x6.0 screws
(1)
that secure the system board to the base enclosure.
3.
Place your fingers underneath the system board in the empty memory module slot
(2)
and gently
apply pressure to slightly flex the system board while lifting the left edge
(3)
.
Component replacement procedures
55