HP Mini 100e HP Mini 100e Education Edition - Maintenance and Service Guide - Page 69

is used on the Northbridge chip, and thermal tape

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4. Remove the heat sink assembly (3). NOTE: Due to the adhesive quality of the thermal material located between the heat sink assembly and system board components, it may be necessary to move the heat sink assembly from side to side to detach the assembly. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink assembly and the system board each time the heat sink assembly is removed. Thermal paste (1) is used on the processor (2), and thermal tape (3) is used on the Northbridge chip (4). Replacement thermal material is included with the heat sink assembly and system board spare part kits. Reverse this procedure to install the fan and heat sink assembly. Component replacement procedures 61

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4.
Remove the heat sink assembly
(3)
.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink
assembly and system board components, it may be necessary to move the heat sink assembly
from side to side to detach the assembly.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink
assembly and the system board each time the heat sink assembly is removed. Thermal paste
(1)
is
used on the processor
(2)
, and thermal tape
(3)
is used on the Northbridge chip
(4)
. Replacement
thermal material is included with the heat sink assembly and system board spare part kits.
Reverse this procedure to install the fan and heat sink assembly.
Component replacement procedures
61