HP Pavilion 11-h110nr HP Pavilion 11 x2 PC Maintenance and Service Guide - Page 55
and the heat sink, each time the heat sink is removed. Replacement thermal material is included
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3. Remove the heat sink (4). NOTE: Due to the adhesive quality of the thermal material located between the heat sink and the system board components, it may be necessary to move the heat sink from side to side to detach it. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the system board (1) and the heat sink (2) each time the heat sink is removed. Replacement thermal material is included with the heat sink and system board spare part kits. Tablet component replacement procedures 47
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3.
Remove the heat sink
(4)
.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink and
the system board components, it may be necessary to move the heat sink from side to side to
detach it.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the system board
(1)
and the heat sink
(2)
each time the heat sink is removed. Replacement thermal material is included
with the heat sink and system board spare part kits.
Tablet component replacement procedures
47