HP dx2290 Service Reference Guide - HP Compaq dx2290 Business PC - Page 38

Memory, DDR2-SDRAM DIMMs, Installing Memory Modules

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Memory The computer comes with double data rate 2 synchronous dynamic random access memory (DDR2SDRAM) dual inline memory modules (DIMMs). CAUTION: DDR and DDR2 memory modules are not interchangeable. DDR2-SDRAM DIMMs The memory sockets on the system board can be populated with up to two industry-standard DIMMs. These memory sockets are populated with at least one preinstalled DIMM. To achieve the maximum memory support, you can populate the system board with up to 2 GB of memory configured in a highperforming dual channel mode. For proper system operation, the DDR2-SDRAM DIMMs must be: ● industry-standard 240-pin ● unbuffered PC2-5300 667 MHz-compliant ● 1.8 volt DDR2-SDRAM DIMMs The DDR2-SDRAM DIMMs must also: In addition, the computer supports: ● 256Mbit, 512Mbit, and 1Gbit non-ECC memory technologies ● single-sided and double-sided DIMMs ● DIMMs constructed with x8 and x16 DDR devices; DIMMs constructed with x4 SDRAM are not supported NOTE: The system will not start if you install unsupported DIMMs. Installing Memory Modules CAUTION: The memory module sockets have gold metal contacts. When upgrading the memory, it is important to use memory modules with gold metal contacts to prevent corrosion and/or oxidation resulting from having incompatible metals in contact with each other. CAUTION: Static electricity can damage the electronic components of the computer or optional cards. Before beginning these procedures, ensure that you are discharged of static electricity by briefly touching a grounded metal object. CAUTION: When handling a memory module, be careful not to touch any of the contacts. Doing so may damage the module. 1. Prepare the computer for disassembly (Preparation for Disassembly on page 26). 2. Remove the access panel and lay the computer down on its side to make it easier to work on (Access Panel on page 28). WARNING! To reduce risk of personal injury from hot surfaces, allow the internal system components to cool before touching. 30 Chapter 6 Removal and Replacement Procedures Microtower (MT) Chassis

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Memory
The computer comes with double data rate 2 synchronous dynamic random access memory (DDR2-
SDRAM) dual inline memory modules (DIMMs).
CAUTION:
DDR and DDR2 memory modules are not interchangeable.
DDR2-SDRAM DIMMs
The memory sockets on the system board can be populated with up to two industry-standard DIMMs.
These memory sockets are populated with at least one preinstalled DIMM. To achieve the maximum
memory support, you can populate the system board with up to 2 GB of memory configured in a high-
performing dual channel mode.
For proper system operation, the DDR2-SDRAM DIMMs must be:
●
industry-standard 240-pin
●
unbuffered PC2-5300 667 MHz-compliant
●
1.8 volt DDR2-SDRAM DIMMs
The DDR2-SDRAM DIMMs must also:
In addition, the computer supports:
●
256Mbit, 512Mbit, and 1Gbit non-ECC memory technologies
●
single-sided and double-sided DIMMs
●
DIMMs constructed with x8 and x16 DDR devices; DIMMs constructed with x4 SDRAM are not
supported
NOTE:
The system will not start if you install unsupported DIMMs.
Installing Memory Modules
CAUTION:
The memory module sockets have gold metal contacts. When upgrading the memory, it
is important to use memory modules with gold metal contacts to prevent corrosion and/or oxidation
resulting from having incompatible metals in contact with each other.
CAUTION:
Static electricity can damage the electronic components of the computer or optional cards.
Before beginning these procedures, ensure that you are discharged of static electricity by briefly
touching a grounded metal object.
CAUTION:
When handling a memory module, be careful not to touch any of the contacts. Doing so
may damage the module.
1.
Prepare the computer for disassembly (
Preparation for Disassembly
on page
26
).
2.
Remove the access panel and lay the computer down on its side to make it easier to work on
(
Access Panel
on page
28
).
WARNING!
To reduce risk of personal injury from hot surfaces, allow the internal system
components to cool before touching.
30
Chapter 6
Removal and Replacement Procedures Microtower (MT) Chassis