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HP dx6120 HP Business Desktop dx6100 Series Personal Computers Service Referen - Page 110

that the latest version of the BIOS is being used on the computer. The latest system ROMPaq can

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Removal and Replacement Procedures- Microtower (MT) Chassis 5. Go to step 7. 6. If using a new heatsink, remove the protective covering from the bottom of the heatsink and place it in position atop the processor. 7. Secure the heatsink to the system board and system board tray with the four captive screws and attach the heatsink control cable to the system board. Ä CAUTION: Heatsink retaining screws should be tightened in diagonally opposite pairs (as in an X) to evenly seat the heatsink on the processor. This is especially important as the pins on the socket are very fragile and any damage to them may require replacing the system board. ✎ After installing a new processor onto the system board, always update the system ROM to ensure that the latest version of the BIOS is being used on the computer. The latest system ROMPaq can be found on the Web at: http:\\h18000.www1.hp.com/support/files. 6-30 361293-002 Service Reference Guide, dx6100

Section	Page
1	11
1.1 Installing or Upgrading Device Drivers	11
1.2 Transferring Files and Settings	12
1.3 Backing Up and Restoring Files	12
1.3.1 Creating a Backup File-Windows XP Professional	12
1.3.2 Restoring from the Backup File-Windows XP Professional	12
1.4 Converting to NTFS	12
1.5 HP Software	12
2	15
2.1 Power-On Self-Test (POST)	15
2.2 Computer Setup Utilities	16
2.2.1 Using Computer Setup (F10) Utilities	17
2.2.2 Computer Setup Menu	18
2.3 Diagnostics for Windows	28
2.3.1 Detecting Diagnostics for Windows	29
2.3.2 Installing Diagnostics for Windows	29
2.3.3 Using Categories in Diagnostics for Windows	30
2.3.4 Running Diagnostic Tests in Diagnostics for Windows	31
2.4 Configuration Record	32
2.4.1 Installing Configuration Record	33
2.4.2 Running Configuration Record	33
3	35
3.1 Initial Configuration and Deployment	35
3.2 Remote System Installation	36
3.3 Software Updating and Management	36
3.3.1 HP Client Manager Software	36
3.3.2 Altiris Client Management Solutions	37
3.3.3 System Software Manager	37
3.3.4 Proactive Change Notification (PCN)	38
3.3.5 Subscriber’s Choice	38
3.3.6 ROM Flash	38
3.3.7 Remote ROM Flash	38
3.3.8 HPQFlash	39
3.3.9 FailSafe Boot Block ROM	39
3.3.10 Replicating the Setup	40
3.3.11 Dual-State Power Button	46
3.3.12 World Wide Web Site	46
3.3.13 Building Blocks and Partners	46
3.4 Asset Tracking and Security	47
3.4.1 Password Security	51
3.4.2 Establishing a Setup Password Using Computer Setup	51
3.4.3 Establishing a Power-On Password Using Computer Setup	51
3.4.4 DriveLock	54
3.4.5 Smart Cover Sensor	56
3.4.6 Master Boot Record Security	58
3.4.7 Before You Partition or Format the Current Bootable Disk	59
3.4.8 Cable Lock Provision	59
3.4.9 Fingerprint Identification Technology	59
3.5 Fault Notification and Recovery	60
3.5.1 Drive Protection System	60
3.5.2 Surge-Tolerant Power Supply	60
3.5.3 Thermal Sensor	60
4	61
4.1 SATA and PATA Device Information	61
4.2 ATA Cables	62
4.2.1 SATA Data Cable	62
4.2.2 SATA Power Cable	62
4.2.3 PATA Data Cable	63
4.2.4 PATA Power Cable	63
4.2.5 PATA Cable Layout	64
4.3 PATA Drive Installation Guidelines	64
4.3.1 PATA Device Classes	65
4.3.2 PATA Attach Sequence Rules by Class Priority	66
4.3.3 PATA Attach Sequence Worksheet	67
4.3.4 PATA Additional Drive Application Notes	69
4.4 ATA SMART Drives	70
4.5 Drive Capacities	70
4.6 SATA BIOS	71
4.6.1 Legacy Mode	71
4.6.2 Native Mode	71
4.7 Mixed Devices Boot and Drive Letter Ordering	72
5	73
5.1 Chassis Designations	73
5.1.1 Microtower (MT)	73
5.1.2 Slim Tower (ST)	74
5.2 Electrostatic Discharge Information	74
5.2.1 Generating Static	74
5.2.2 Preventing Electrostatic Damage to Equipment	75
5.2.3 Personal Grounding Methods and Equipment	75
5.2.4 Grounding the Work Area	76
5.2.5 Recommended Materials and Equipment	76
5.3 Operating Guidelines	77
5.4 Routine Care	77
5.4.1 General Cleaning Safety Precautions	77
5.4.2 Cleaning the Computer Case	78
5.4.3 Cleaning the Keyboard	78
5.4.4 Cleaning the Monitor	78
5.4.5 Cleaning the Mouse	79
5.5 Service Considerations	79
5.5.1 Power Supply Fan	79
5.5.2 Tools and Software Requirements	79
5.5.3 Screws	79
5.5.4 Cables and Connectors	80
5.5.5 Hard Drives	80
5.5.6 Lithium Coin Cell Battery	80
Removal and Replacement Procedures- Microtower (MT) Chassis	81
6.1 Preparation for Disassembly	81
6.2 External Security Devices	82
6.2.1 Installing a Cable Lock	82
6.2.2 Installing a Padlock	83
6.3 Access Panel	84
6.4 Front Bezel	85
6.5 Front Drive Bezels	87
6.5.1 5.25\	87
6.5.2 Diskette Drive Bezel	88
6.5.3 3.5\	88
6.6 Cable Management	89
6.7 Memory Modules	90
6.8 Expansion Cards	91
6.8.1 Expansion Slot Cover	91
6.8.2 Standard PCI Expansion Card	92
6.8.3 PCI Express Expansion Card	95
6.9 Drives	98
6.9.1 Drive Positions	98
6.9.2 Removing a Drive	99
Disconnecting Optical Drive Cables	99
Disconnecting Diskette Drive Cables	99
Disconnecting Hard Drive Cables	100
Releasing the Drives	100
6.9.3 Installing a Drive	101
Connecting Optical Drive Cables	102
Connecting Diskette Drive Cables	102
Connecting Hard Drive Cables	103
6.10 Chassis Fan	104
6.11 Front I/O Panel Housing Assembly	105
6.12 Front I/O Devices	106
6.13 Power Switch Assembly	107
6.14 Heatsink	108
6.15 Processor	109
6.16 System Board	111
6.17 Battery	112
6.17.1 Type 1 Battery Holder	113
6.17.2 Type 2 Battery Holder	114
6.17.3 Type 3 Battery Holder	115
6.18 Speaker	116
6.19 Power Supply	117
Removal and Replacement Procedures- Slim Tower (ST) Chassis	119
7.1 Preparation for Disassembly	119
7.2 Unlocking the Smart Cover Lock	121
7.3 Hood Sensor	123
7.4 External Security Devices	124
7.4.1 Security Clip	124
7.4.2 Cable Lock	124
7.4.3 Padlock	125
7.4.4 Universal Chassis Clamp Lock	125
7.5 Computer Cover	129
7.6 Front Drive Bezels	130
7.7 Cable Management	132
7.8 Memory	134
7.9 Vertically Oriented Expansion Card	136
7.9.1 Expansion Card Retainer	136
7.9.2 PCI Expansion Card	137
7.9.3 PCI Express Expansion Card	139
7.10 Horizontally Oriented Expansion Card	140
7.10.1 Expansion Card Cage	140
7.10.2 PCI Expansion Card	140
7.10.3 Riser Card	143
7.11 Drives	144
7.11.1 Drive Positions	144
7.11.2 Optical Drive	145
7.11.3 External 3.5-inch Drive	147
7.11.4 Primary Hard Drive	148
7.12 Fan Shroud	152
7.13 Front I/O Devices	153
7.14 Power Switch Assembly	157
7.15 Heatsink	158
7.16 Processor	159
7.17 Speaker	161
7.18 Power Supply	162
7.19 System Board	164
7.20 Chassis Fan	169
7.21 Backwall	170
7.22 Battery	176
7.22.1 Type 1 Battery Holder	177
7.22.2 Type 2 Battery Holder	178
7.22.3 Type 3 Battery Holder	179
A	181
B	191
C	193
D	203
E	237

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361293-002

Service Reference Guide, dx6100

Removal and Replacement Procedures— Microtower (MT) Chassis

5. Go to step 7.

6. If using a new heatsink, remove the protective covering from the bottom of the heatsink and

place it in position atop the processor.

7. Secure the heatsink to the system board and system board tray with the four captive screws

and attach the heatsink control cable to the system board.

CAUTION:

Heatsink retaining screws should be tightened in diagonally opposite pairs (as in an X) to

evenly seat the heatsink on the processor. This is especially important as the pins on the socket are very

fragile and any damage to them may require replacing the system board.

✎

After installing a new processor onto the system board, always update the system ROM to ensure

that the latest version of the BIOS is being used on the computer. The latest system ROMPaq can

be found on the Web at: http:\\h18000.www1.hp.com/support/files.