HP 11-f100 Maintenance and Service Guide - Page 30
on the processor, that services it.
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9. Remove the keyboard/top cover (5). NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the keyboard/top cover is removed. Thermal paste is used on the processor (1) and the heat sink section (2) that services it. 22 Chapter 5 Removal and replacement procedures
9.
Remove the keyboard/top cover
(5)
.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink
and the system board components each time the keyboard/top cover is removed. Thermal paste is used
on the processor
(1)
and the heat sink section
(2)
that services it.
22
Chapter 5
Removal and replacement procedures