HP 14-bp100 Maintenance and Service Guide - Page 54

UMA graphics models with 6 W Intel Pentium and Celeron processors, that secure the heat sink

Page 54 highlights

● Thermal paste is used on the processor (1) and associated heat sink area (2). NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the heat sink, processor, and system board spare part kits. 5. UMA graphics models with 6 W Intel Pentium and Celeron processors: In the order indicated on the heat sink, remove the four longer screws (1) and three shorter screws (2) that secure the heat sink to the system board. 6. Remove the heat sink from the system board (3). 46 Chapter 5 Removal and replacement procedures for Authorized Service Provider parts

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Thermal paste is used on the processor
(1)
and associated heat sink area
(2)
.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the heat sink is removed. Replacement thermal material
is included with the heat sink, processor, and system board spare part kits.
5.
UMA graphics models with 6 W Intel Pentium and Celeron processors:
In the order indicated on the
heat sink, remove the four longer screws
(1)
and three shorter screws
(2)
that secure the heat sink to
the system board.
6.
Remove the heat sink from the system board
(3)
.
46
Chapter 5
Removal and replacement procedures for Authorized Service Provider parts