HP 14-bp100 Maintenance and Service Guide - Page 55
is included with the heat sink, processor, and system board spare part kits.
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● Thermal paste is used on the processor (1) and associated heat sink area (2). NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the heat sink, processor, and system board spare part kits. Reverse this procedure to reassemble and install the heat sink. Component replacement procedures 47
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●
Thermal paste is used on the processor
(1)
and associated heat sink area
(2)
.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the heat sink is removed. Replacement thermal material
is included with the heat sink, processor, and system board spare part kits.
Reverse this procedure to reassemble and install the heat sink.
Component replacement procedures
47