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HP ENVY m6-n012dx HP ENVY m6 Notebook PC Maintenance and Service Guide - Page 59

with the heat sink, processor

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3. Remove the heat sink (2). NOTE: Due to the adhesive quality of the thermal material located between the heat sink and the system board components, it may be necessary to move the heat sink from side to side to detach it. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the heat sink, processor, and system board spare part kits. Thermal paste is used on the processor (1) and the heat sink section (2) that services it. Component replacement procedures 51

Section	Page
Product description	9
External component identification	12
Finding your hardware and software information	12
Locating hardware	12
Locating software	12
Display	13
Buttons and speakers	14
Keys	15
Lights	16
TouchPad	17
Left side	18
Right side	20
Bottom	21
Illustrated parts catalog	22
Service tag	22
Computer major components	23
Mass storage devices	26
Miscellaneous parts	27
Sequential part number listing	27
Removal and replacement procedures preliminary requirements	30
Tools required	30
Service considerations	30
Plastic parts	30
Cables and connectors	31
Drive handling	31
Grounding guidelines	32
Electrostatic discharge damage	32
Packaging and transporting guidelines	33
Workstation guidelines	33
Equipment guidelines	34
Removal and replacement procedures for Customer Self-Repair parts	35
Component replacement procedures	35
Battery	36
WLAN module	37
Hard drive	40
Memory module	42
Removal and replacement procedures for Authorized Service Provider parts	45
Component replacement procedures	45
RTC battery	45
Base enclosure	47
Display assembly	49
Fan	52
System board	53
Heat sink	58
Processor	60
Connector board	62
Power connector cable	63
Subwoofer	64
Speakers	66
TouchPad assembly	68
Power button board	70
Keyboard	71
Using Setup Utility (BIOS) and HP PC Hardware Diagnostics (UEFI)	74
Starting Setup Utility (BIOS)	74
Updating the BIOS	74
Determining the BIOS version	74
Downloading a BIOS update	75
Using HP PC Hardware Diagnostics (UEFI)	76
Downloading HP PC Hardware Diagnostics (UEFI) to a USB device	76
Specifications	77
Computer specifications	77
Backing up, restoring, and recovering	78
Creating recovery media and backups	78
Creating HP Recovery media	79
Restore and recovery	80
Recovering using HP Recovery Manager	80
What you need to know	81
Using the HP Recovery partition (select models only)	81
Using HP Recovery media to recover	82
Changing the computer boot order	82
Removing the HP Recovery partition	82
Power cord set requirements	83
Requirements for all countries	83
Requirements for specific countries and regions	84
Recycling	85

Match case Limit results 1 per page

Remove the heat sink

(2)

NOTE:

Due to the adhesive quality of the thermal material located between the heat sink and

the system board components, it may be necessary to move the heat sink from side to side to

detach it.

NOTE:

The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the

system board components each time the heat sink is removed. Replacement thermal material is included

with the heat sink, processor, and system board spare part kits. Thermal paste is used on the processor

(1)

and the heat sink section

(2)

that services it.

Component replacement procedures