HP GbE2c HP BladeSystem c7000 Enclosure Maintenance and Service Guide - Page 44
Onboard Administrator blank, Onboard Administrator
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4. Remove the interconnect bay divider. To replace the component, reverse the removal procedure. Onboard Administrator blank Remove the component as indicated. CAUTION: For best cooling practices, do not operate the enclosure for extended periods with more than one component or blank removed. When removing an active component, replace it with a blank. To replace the component, reverse the removal procedure. Onboard Administrator To remove the component: Removal and replacement procedures 44
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Removal and replacement procedures
44
4.
Remove the interconnect bay divider.
To replace the component, reverse the removal procedure.
Onboard Administrator blank
Remove the component as indicated.
CAUTION:
For best cooling practices, do not operate the enclosure for extended periods with
more than one component or blank removed. When removing an active component, replace
it with a blank.
To replace the component, reverse the removal procedure.
Onboard Administrator
To remove the component: