HP Superdome SX2000 User Service Guide, Seventh Edition - HP Integrity Superdo - Page 4

System Specifications, Installing the System, Mixed PCI-X and PCI Express I/O Chassis

Page 4 highlights

Cell Map...35 Link Interleaving...35 Memory Error Protection...35 DRAM Erasure...36 PDC Functional Changes...36 Platform Dependent Hardware...36 Reset...37 Cell OL*...37 I/O Subsystem...37 PCI-X Backplane Functionality...38 SBA Chip CC-to-Ropes...38 Ropes-to-PCI LBA Chip...39 PCI Slots...40 Mixed PCI-X and PCI Express I/O Chassis 40 PCI Hot-Swap Support...41 System Management Station...41 User Accounts...42 New Server Cabling...42 m-Link Cable...42 e-Link Cable...42 Clock Cable...44 Firmware...44 Itanium Firmware for HP Integrity Superdome/sx2000 44 Itanium System Firmware Functions 46 PA-RISC Firmware for HP 9000/sx2000 Servers 46 PA-RISC System Firmware Functions 47 Server Configurations...47 Server Errors...48 2 System Specifications 49 Dimensions and Weights...49 Component Dimensions...49 Component Weights...49 Shipping Dimensions and Weights 50 Electrical Specifications...50 Grounding...51 Circuit Breaker...51 Power Options...51 System Power Requirements...52 Component Power Requirements 53 IOX Cabinet Power Requirements 53 IOX Cabinet Power Cords...53 Environmental Requirements...54 Temperature and Humidity Specifications 54 Power Dissipation...54 Acoustic Noise Specification...56 Airflow...56 3 Installing the System...59 Introduction ...59 Communications Interference ...59 Electrostatic Discharge ...59 Public Telecommunications Network Connection 60 4 Table of Contents

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Cell Map
................................................................................................................................
35
Link Interleaving
...................................................................................................................
35
Memory Error Protection
...........................................................................................................
35
DRAM Erasure
...........................................................................................................................
36
PDC Functional Changes
.................................................................................................................
36
Platform Dependent Hardware
.......................................................................................................
36
Reset
.................................................................................................................................................
37
Cell OL*
...........................................................................................................................................
37
I/O Subsystem
.......................................................................................................................................
37
PCI-X Backplane Functionality
........................................................................................................
38
SBA Chip CC-to-Ropes
..............................................................................................................
38
Ropes-to-PCI LBA Chip
.............................................................................................................
39
PCI Slots
.....................................................................................................................................
40
Mixed PCI-X and PCI Express I/O Chassis
...........................................................................
40
PCI Hot-Swap Support
.........................................................................................................
41
System Management Station
................................................................................................................
41
User Accounts
..................................................................................................................................
42
New Server Cabling
..............................................................................................................................
42
m-Link Cable
...................................................................................................................................
42
e-Link Cable
.....................................................................................................................................
42
Clock Cable
......................................................................................................................................
44
Firmware
...............................................................................................................................................
44
Itanium Firmware for HP Integrity Superdome/sx2000
.................................................................
44
Itanium System Firmware Functions
.........................................................................................
46
PA-RISC Firmware for HP 9000/sx2000 Servers
..............................................................................
46
PA-RISC System Firmware Functions
........................................................................................
47
Server Configurations
...........................................................................................................................
47
Server Errors
.........................................................................................................................................
48
2 System Specifications
...................................................................................................
49
Dimensions and Weights
......................................................................................................................
49
Component Dimensions
..................................................................................................................
49
Component Weights
........................................................................................................................
49
Shipping Dimensions and Weights
.................................................................................................
50
Electrical Specifications
.........................................................................................................................
50
Grounding
.......................................................................................................................................
51
Circuit Breaker
.................................................................................................................................
51
Power Options
.................................................................................................................................
51
System Power Requirements
...........................................................................................................
52
Component Power Requirements
...................................................................................................
53
IOX Cabinet Power Requirements
...................................................................................................
53
IOX Cabinet Power Cords
...............................................................................................................
53
Environmental Requirements
...............................................................................................................
54
Temperature and Humidity Specifications
.....................................................................................
54
Power Dissipation
............................................................................................................................
54
Acoustic Noise Specification
...........................................................................................................
56
Airflow
.............................................................................................................................................
56
3 Installing the System
.....................................................................................................
59
Introduction
.........................................................................................................................................
59
Communications Interference
........................................................................................................
59
Electrostatic Discharge
...................................................................................................................
59
Public Telecommunications Network Connection
..........................................................................
60
4
Table of Contents