HP ZBook Studio G3 Maintenance and Service Guide - Page 55

Discrete models, UMA models, Discrete graphics models, material is included with the thermal module

Page 55 highlights

4. Remove the fan/heat sink assembly (5). CAUTION: When lifting the heat sink out of the computer, be careful not to bend the arm that connects the fans. Discrete models: UMA models: NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system board components each time the fan/heat sink assembly is removed. Replacement thermal material is included with the thermal module, processor, and system board spare part kits. Discrete graphics models: ● Various thermal pads are used on the system board components and the heat sink sections and that service them. See the following image for thermal pad locations. Component replacement procedures 41

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
  • 101
  • 102
  • 103
  • 104
  • 105
  • 106
  • 107
  • 108
  • 109
  • 110
  • 111
  • 112
  • 113
  • 114
  • 115
  • 116
  • 117
  • 118
  • 119
  • 120
  • 121
  • 122
  • 123
  • 124
  • 125
  • 126
  • 127
  • 128
  • 129
  • 130
  • 131
  • 132
  • 133
  • 134
  • 135
  • 136
  • 137
  • 138
  • 139
  • 140
  • 141
  • 142
  • 143
  • 144
  • 145
  • 146
  • 147
  • 148
  • 149
  • 150
  • 151
  • 152
  • 153
  • 154
  • 155
  • 156
  • 157
  • 158
  • 159
  • 160
  • 161
  • 162
  • 163
  • 164
  • 165
  • 166
  • 167
  • 168
  • 169
  • 170
  • 171
  • 172
  • 173
  • 174
  • 175
  • 176
  • 177
  • 178
  • 179
  • 180
  • 181
  • 182
  • 183
  • 184
  • 185
  • 186
  • 187

4.
Remove the fan/heat sink assembly
(5)
.
CAUTION:
When lifting the heat sink out of the computer, be careful not to bend the arm that connects
the fans.
Discrete models:
UMA models:
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly
and the system board components each time the fan/heat sink assembly is removed. Replacement thermal
material is included with the thermal module, processor, and system board spare part kits.
Discrete graphics models:
Various thermal pads are used on the system board components and the heat sink sections and that
service them. See the following image for thermal pad locations.
Component replacement procedures
41