Intel BX80580Q9400 User Manual - Page 11

Table 3., Acronyms - motherboard

Page 11 highlights

About This Manual Term/Acronym Media Expansion Card Pad Pillar Rock Pin Silver Cascade System Bus System Management Bus VCC (CPU core) Definition The Media Expansion Card (MEC) provides digital display options through the SDVO interface. The MEC card also incorporates video-in via a x1 PCI Express* port. The electrical contact point of a semiconductor die to the package substrate. A pad is only observable in simulations. The name of the development board that uses Intel® Core™ 2 Duo processor with the Mobile Intel GM45 Express Chipset and DDR2 SDRAM The contact point of a component package to the traces on a substrate, such as the motherboard. Signal quality and timings may be measured at the pin. The name of the development board that uses Intel® Core™ 2 Duo processor with the Mobile Intel GM45 Express Chipset and DDR3 SDRAM The System Bus is the microprocessor bus of the processor. A two-wire interface through which various system components may communicate. VCC (CPU core) is the core power for the processor. The system bus is terminated to VCC (CPU core). Table 3 defines the acronyms used throughout this document. Table 3. Acronyms Acronym AC ACPI ADD2 ADD2N AGTL or AGTL+ AMI AMPS or iAMPS AMT or iAMT ATA ATX BGA BIOS BSEL CL CMOS COM CPU Definition Alternating Current Advanced Configuration and Power Interface Advanced Digital Display 2 Advanced Digital Display 2 Normal Assisted Gunning Transceiver Logic (See also Table 2 above) American Megatrends Inc. (BIOS developer) (Intel) Adaptive Mobile Power System (Intel) Active Management Technology Advanced Technology Attachment (disk drive interface) Advance Technology Extended (motherboard form factor) Ball Grid Array Basic Input/Output System Bus Select (Front Side Bus frequency control signals) Controller Link Complementary Metal-Oxide-Semiconductor Communications Central Processing Unit (processor) Development Kit User's Manual 11

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About This Manual
Development Kit User’s Manual
11
Term/Acronym
Definition
Media Expansion
Card
The Media Expansion Card (MEC) provides digital display options through
the SDVO interface. The MEC card also incorporates video-in via a x1 PCI
Express* port.
Pad
The electrical contact point of a semiconductor die to the package
substrate. A pad is only observable in simulations.
Pillar Rock
The name of the development board that uses Intel
®
Core™ 2 Duo
processor with the Mobile Intel
GM45
Express Chipset and
DDR2
SDRAM
Pin
The contact point of a component package to the traces on a substrate,
such as the motherboard. Signal quality and timings may be measured at
the pin.
Silver Cascade
The name of the development board that uses Intel
®
Core™ 2 Duo
processor with the Mobile Intel
GM45
Express Chipset and
DDR3
SDRAM
System Bus
The System Bus is the microprocessor bus of the processor.
System
Management Bus
A two-wire interface through which various system components may
communicate.
VCC (CPU core)
VCC (CPU core) is the core power for the processor. The system bus is
terminated to VCC (CPU core).
Table 3
defines the acronyms used throughout this document.
Table 3.
Acronyms
Acronym
Definition
AC
Alternating Current
ACPI
Advanced Configuration and Power Interface
ADD2
Advanced Digital Display 2
ADD2N
Advanced Digital Display 2 Normal
AGTL or AGTL+
Assisted Gunning Transceiver Logic
(See also Table 2 above)
AMI
American Megatrends Inc. (BIOS developer)
AMPS or iAMPS
(Intel) Adaptive Mobile Power System
AMT or iAMT
(Intel) Active Management Technology
ATA
Advanced Technology Attachment (disk drive interface)
ATX
Advance Technology Extended (motherboard form factor)
BGA
Ball Grid Array
BIOS
Basic Input/Output System
BSEL
Bus Select (Front Side Bus frequency control signals)
CL
Controller Link
CMOS
Complementary Metal-Oxide-Semiconductor
COM
Communications
CPU
Central Processing Unit (processor)